Ecosystem emerges around new mobile chip tech
George Leopold, EETimes
7/11/2012 12:15 PM EDT
SAN FRANCISCO A consortium touting fully depleted silicon-on-insulator (FDSOI) technology for mobile computing applications presented a united front this week in promoting the process technology as a viable alternative to Intels FinFET manufacturing approach.
ARM, IBM, Soitec and STMicroelectronics along with foundry partner Globalfoundries and R&D organizations like CEA-Leti made their case for the FDSOI approach at the Semicon West conference here. They also stressed the need for collaborative innovation as new mobile technologies grow in complexity and cost. The need to collaborate has never been more important, said Gary Patton, vice president of IBMs Semiconductor R&D Center.
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