WiLAN Announces Consolidation of Cases Involving Apple, HTC and Other Parties
OTTAWA, CANADA-- Sept. 17, 2012 - Wi-LAN Inc. ("WiLAN") (TSX:WIN) (NASDAQ:WILN) today provided a litigation update regarding the consolidation of two cases before the U.S. District Court for the Eastern District of Texas, Tyler and Marshall Divisions respectively. Both cases pertain to infringement of WiLAN's Patent No. RE37,802 (the "802 patent") related to CDMA and HSPA and U.S. Patent No. 5,282,222 (the "222 patent") related to Wi-Fi and LTE.
On February 2, 2011, WiLAN commenced litigation in the U.S. District Court for the Eastern District of Texas, Marshall Division against HTC Corp., HTC America, Inc., and Exedea, Inc. (the "HTC" case). On September 1, 2011, WiLAN filed another suit in the U.S. District Court for the Eastern District of Texas, Tyler Division against HTC as well as Apple, Inc. and other parties (the "Apple case").
On September 14, 2012, the Court granted WiLAN's motion to transfer the Apple case from the Tyler Division to the Marshall Division, having the result of advancing the Apple case trial date by eight months. The trial date for the consolidated Apple and HTC cases is expected to be August 5, 2013.
About WiLAN
WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to over 260 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G and 4G handsets, Wi-Fi-enabled laptops, Wi-Fi and broadband routers, xDSL infrastructure equipment, cellular base stations and digital television receivers. WiLAN has a large and growing portfolio of more than 3,000 issued or pending patents. For more information: www.wilan.com.
|
Related News
Breaking News
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |