Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Tensilica's HiFi Audio/Voice DSP and Acoustic Technologies' SoundClear Voice Solution Shipping in Leading Smartphones to Provide Optimal Speech Intelligibility
SANTA CLARA, CA-- February 13, 2013 -- Tensilica®, Inc., the leading licensor of audio/voice DSP cores, and Acoustic Technologies, Inc., a worldwide leader in high quality voice processing solutions, are delivering HD voice to the mobile market and will demonstrate their solutions for smartphones, tablets and mobile computing at booth 6-D101 at the Mobile World Congress in Barcelona from February 25 - 28. Acoustic's wideband SoundClear® Voice software has been optimized for the HiFi family of DSP (digital signal processing) cores to provide advanced multi-mic noise reduction and full-duplex speakerphone performance. SoundClear Voice is shipping today in leading smartphones and other mobile devices and accessory products.
"Acoustic's SoundClear Voice solutions are broadly adopted by leading consumer electronics vendors," stated Larry Przywara, Tensilica's senior director of multimedia marketing. "Their HD voice solution ensures mobile users get the best possible call quality as network operators and mobile device makers rollout wideband HD voice on their networks."
Acoustic Technologies' voice processing solution is proven with tier one smartphone vendors, and the world's largest network operators, to deliver high quality voice performance in handset, speakerphone and headset modes. The HD multi-mic noise cancellation includes Acoustic's InstantAdapt feature, dynamic microphone balancing technology and FlexEQ equalization to deliver clear speech anywhere. Wideband voice doubles the sampling rate of narrowband voice to deliver expanded frequency response at both lower and upper ends of the voice spectrum. The dramatically improved voice quality improves the user experience on mobile networks that have deployed HD voice and for VoIP applications. The improvements in sound fidelity and clear speech also improve recognition rates in noise for ASR (automatic speech recognition) applications.
"The HiFi DSPs are ideal for running our advanced HD voice solutions for smartphones requiring best-in-class multi-mic noise reduction and speakerphone performance," said Bob Ackmann, CEO of Acoustic Technologies. "The HiFi DSPs offer leading DSP performance, low power and high quality tools that enable us to deliver optimized wideband voice solutions to our customers."
Tensilica's HiFi Audio/Voice DSPs are the leading audio/voice DSP IP cores, licensed by over 50 customers including five of the top 10 semiconductor manufacturers and many leading system OEMs. The HiFi Audio/Voice DSPs support over 100 audio/voice software packages with very efficient processing at low power and they are part of Tensilica's growing line of dataplane processors (DPUs) that efficiently do the challenging, compute-intensive tasks in SOC designs.
Visit Tensilica and Acoustic Technologies in Hall 6 Stand 6D101 during Mobile World Congress for a demo and further details on the wideband HD voice solution for HiFi.
About Acoustic Technologies
Acoustic Technologies creates high quality voice processing software for leading consumer electronics companies. The SoundClear® brand of patented full-duplex communication, echo cancellation, noise reduction, and speech enhancement solutions is enabling significant advancements in mobile and VoIP calling. SoundClear provides natural, clear audio for smartphones, tablets, and laptops as well as for Bluetooth headsets, speakerboxes, car radios, GPS navigation devices, and hands-free kits. Visit www.acoustictech.com for additional information.
Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.