Hsinchu, Taiwan and Cambridge, UK April 2, 2013 ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARM® Cortex-A57 processor on FinFET process technology. The Cortex-A57 processor is ARMs highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies. The two companies cooperated in the implementation from RTL to tape-out in six months using ARM Artisan® physical IP, TSMC memory macros, and EDA technologies enabled by TSMCs Open Innovation Platform® (OIP) design ecosystem.
ARM and TSMCs collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.
This first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology, said Tom Cronk, executive vice president and general manager, Processor Division, ARM. The joint effort of ARM, TSMC, and TSMCs OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLE processing and ARM POP IP across a wide variety of market segments.
Our multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications, said Dr. Cliff Hou, TSMC Vice President of R&D. This achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMCs advanced technology.
This announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. This successful collaborative milestone is confirmation of the roles that TSMCs OIP and ARMs Connected Community play in promoting innovation for the semiconductor design industry.
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARMs comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the companys broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM http://www.arm.com/
TSMC is the worlds largest dedicated semiconductor foundry, providing the industrys leading process technology and the foundrys largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Companys managed capacity in 2012 totaled 15.1 million (8-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB facilities, four eight-inch fabs, one six-inch fab, as well as TSMCs wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 28nm production capabilities. TSMCs corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.