Provides lower cost, better performance and greater design flexibility
SHANGHAI, Sept. 23, 2013 -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, today announced the availability of its diversifying eNVM (embedded Non-Volatile Memory) platform to provide highly differentiated technologies that address customer needs in low cost, low power, high performance, and high reliability for their product competitiveness. SMIC's comprehensive eNVM platform includes eEEPROM (embedded Electrically Erasable Programmable Read-Only Memory), eFlash (embedded Flash memory), MTP (Multi-Time Programmable), and OTP (One-Time Programmable) at both 0.18µm and 0.13µm technology nodes, along with 55nm eFlash process with target readiness by 2Q14.
The company has extensive design support for the eNVM platform. For each technology node, the design support package begins with a PDK (Process Design Kit) that provides basic technology information and includes optional components such as MiM caps, bit cells, ESD structures, etc. In addition, the platform incorporates EEPROM, Flash, ROM, VR, OSC, I/O, PLL, ADC, LDO, USB, memory compiler, standard cell libraries, and security related light detector and voltage detector IP. It also offers specialty components such as eDRAM and eFuse. In addition to the aforementioned IP, SMIC also offers customization of IP to meet customers' unique design requirements.
The company's eNVM platform is suitable for a wide range of applications for consumer, industrial, and automobile electronics, such as MCU (Microcontrollers), touch panels, and a series of smart card applications covering SIM cards, social security cards, transportation cards, bank cards, and more. Designs for these applications typically push the limits of performance, reliability, and size, and pose significant challenges in power reduction. SMIC's eNVM platform has been adopted by leading partners in the industry. This production-proven eNVM platform incorporates a broad range of low-power and high-performance capabilities, giving SMIC customers the requirements needed in today's chip designs.
"Customers are looking for solutions that match their unique performance goals and low-power requirements," said Dr. TY Chiu, Chief Executive Officer & Executive Director of SMIC. "We are proud that SMIC's production-proven eNVM platform meets our customers' diversified IC requirements. This is part of our differentiation strategy to bring added value to customers and targeting sustainable growth and profitability to SMIC."
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.
For more information, please visit www.smics.com.