Vivante Corporation Joins the drawElements Quality Program
HELSINKI, Finland – November 1st, 2013 – drawElements, a leader in graphics processing (GPU) analysis software, today announced that Vivante Corporation has subscribed to the drawElements Quality Program. The drawElements Quality Program (dEQP) focuses on quality assurance (QA) and consists of multiple application programming interface (API) test modules that ensure robust OpenGL ES, EGL, and OpenCL vendor implementations. Investments in quality assurance help bring new technologies to market faster, with lower associated risks and a higher satisfaction of product usability.
“As a graphics processing IP solutions provider, we focus heavily on product quality and how it performs in front of a user. When a consumer uses a Vivante powered smartphone, tablet, 4K TV, or IoT device, the visual interface must be responsive and fluid, while maintaining a high level of quality and accuracy. As our existing products and latest Vega OpenGL ES 3.0 product line go through dEQP, these tests help ensure we keep our high level of product quality,” said Wei-Jin Dai, Vivante President and CEO.
drawElements has an extensive OpenGL ES 3.0 test module that has been added to their highly successful dEQP tool. As one of the early tools for OpenGL ES 3.0 quality assurance, dEQP OpenGL ES 3.0 Module has given developers a faster way to test quality, accuracy, precision, feature conformance, and stability of the latest APIs. The test tool also automates the QA process and reduces testing times, which can be one of the most time consuming steps in product development. The dEQP OpenGL ES 3.0 Module has been available for download since the launch of the specification in Fall 2012.
”We are excited to have Vivante on board the drawElements Quality Program. Our growing customer base is a welcomed sign of an industry that truly cares about the full quality of its products,” said Kalle Raita, drawElements CEO. “Working with industry-leading companies like Vivante gives us an excellent overview of the latest movements in this fast paced market. We are working hard to ensure that our customers get the best tools possible that respond to the needs of the market.”
As more companies join the drawElements Quality Program, drawElements is looking into providing even more extensive tools and new modules to its solutions.
About Vivante Corporation
Smaller – Faster – Cooler: Vivante Corporation, a leader in multi-core GPU, OpenCL™, CPC Composition Engine and Vector Graphics IP solutions, provides the highest performance and lowest power characteristics across a range of Khronos™ Group API conformant standards based on the ScalarMorphic™ architecture. Vivante GPUs are integrated into customer silicon solutions in mass market products including smartphones, tablets, HDTVs, consumer electronics and embedded devices, running thousands of graphics applications across multiple operating systems and software platforms. Vivante is a privately held company headquartered in Sunnyvale, California, with additional R&D centers in Shanghai and Chengdu.
Further information can be found from http://www.vivantecorp.com
About drawElements
drawElements is a software expert company focused on computer graphics technologies for the embedded space. Our main product is the drawElements Quality Program, a benchmarking system for measuring the quality of GPUs and their drivers. Our crew has also been working on related technologies such as run-time optimized blitters, OpenGL ES 2.0 drivers and software rasterizers. drawElements is based out of Helsinki, Finland.
Further information can be found from http://www.drawelements.com.
|
Related News
- Vivante Joins TSMC IP Alliance Program
- Cornell Tech Joins BrainChip University AI Accelerator Program
- CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |