Industry View: Addressing Datacom Memory Pain Points
Kristin Lewotsky
10/29/2013 09:00 AM EDT
SANTA CLARA, Calif. — According to some estimates, 90 percent of the world's data has been produced in the past two years. Users talk airily about the cloud, but the reality is that all of those bits and bytes have to reside somewhere, typically in datacenters where they must be managed, monitored, and accessed.
That makes for some startling market numbers. The data communications infrastructure market is estimated by Gartner at $10 billion, and its compound annual bandwidth growth rate is expected to be 40 percent. Of that, the SoC memory market, including routers, Ethernet devices, storage-area networking infrastructure, mobile infrastructure, etc., is on the order of $250 million or more.
As the era of terabit computing looms ever closer, the challenges only compound. We talked with Sundar Iyer, CEO and co-founder of Memoir Systems, and Shadab Nazar, Memoir's director of product management, about power, performance, the search for smarter memory, and the battle for speed.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Memoir Systems Introduces Renaissance for Datacom Memory IP Enabling Terabit Computing
- Industry View: Doug Wong of Toshiba on the Future of Memory
- sureCore announces low power memory compiler for 16nm FinFET
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- embedded world 2024: Codasip demonstrates CHERI memory protection
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results