1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
Sckipio G.fast Technology Zooms Ahead with Arteris FlexNoC IP for Ultra-Fast Broadband
Network-on-Chip (NoC) interconnect technology pioneer delivers flexibility and improved time-to-market while reducing risk
CAMPBELL, California – December 11, 2013 – Arteris Inc., the inventor and leading supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that fabless semiconductor company Sckipio of Tel Aviv, Israel has chosen the Arteris FlexNoC fabric IP for their G.fast chipsets.
Demand for broadband continues to grow, with cloud-based services and video-rich content pushing the need for consumer bandwidth. Service providers have turned to the new ITU G.fast communications standard to maximize existing copper infrastructure. Delivering 1 Gbps per subscriber, with a flexible downlink/uplink, G.fast delivers ultra-high speed broadband while eliminating new infrastructure and backhaul costs. Sckipio chipsets will leverage the Arteris’ FlexNoC interconnect fabric IP to drive high throughput while supporting low latencies for realtime response.
“Just as the Sckipio solution helps service providers get the most out of their existing Cat-3 twisted pair, the Arteris’ FlexNoC technology helps us get the most out of our design and development phase,” said Ron Stereson, Vice President of R&D for Sckipio. “FlexNoC fabric IP speeds our time to market – and lets us make mission-critical changes at the very end of the design process. This reduced risk gives us confidence that our products will be right every time.” “Sckipio placed their confidence in our FlexNoC interconnect to work with this burgeoning new standard and meet its strict telecommunications demands,” said K. Charles Janac, President and CEO of Arteris. “Our user interface, tools performance and reputation for solid execution made Arteris the best partner to drive G.fast into the market.”
About Arteris
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
About Sckipio
Sckipio is a semiconductor company dedicated to delivering ultra-high-speed broadband using next-generation G.fast-based modems in Fiber-to-the-distribution point (FTTdp) architectures. Sckipio offers a complete G.fast solution – chipsets bundled with software – for a variety of access and mobile backhaul applications based on the ITU G.fast G.9700 and G.9701 standards, to which Sckipio is a leading contributor. Founded by a veteran team of communications experts with deep experience in broadband access and home networking solutions, and backed by leading venture capitalists, Sckipio is well positioned to win the market for the next-generation of broadband access solutions. For more information about Sckipio, visit our website at www.sckipio.com.
|
Arteris Hot IP
Related News
- Arteris Helps Sckipio Deliver the World's First G.fast Modems
- Sckipio Licenses and Deploys CEVA-XC Communications DSP in World's First G.fast Chipsets
- The World's First G.fast Chipsets Announced by Sckipio
- Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
- Arteris Joins TSMC Reference Flow 12.0 With Flexnoc Network-on-Chip (NoC) Interconnect IP
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |