GUC and M31 Technology Bundle USB 3.0 Peripheral Device Controller and PHY IP
Ideal for a variety of high speed applications
Hsinchu, Taiwan, December 30, 2013 - Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, and M31 Technology, a global boutique Intellectual Property (IP) provider today unveiled a combination USB 3.0 IP that bundles GUC’s Peripheral Device Controller IP and M31 Technology’s PHY IP that is now available on 65/55nm, 40nm, and 28nm process technologies.
This new solution has successfully passed compatibility test and gained certification at the USB-IF Compliance Workshop Taiwan held in November, 2013. It is ideal for mega storage, communications transmission, video and audio applications. The bundled solution eliminates separate testing of PHY and device controllers. This allows companies to focus valuable engineering resources on application and product design activities, saving both design time and budget.
The GUC USB 3.0 Device Controller IP supports SuperSpeed USB peripheral functions, providing information a transfer speeds 10 times faster than Hi-Speed USB. It is backwards compatible with USB 2.0 to ensure interoperability between existing USB products. The IP has passed the USB-IF SuperSpeed product testing procedures. GUC has been a USB-IF certified integrators in 2011.
The M31 Technology USB 3.0 transceiver IP provides a complete range of USB 3.0 host and peripheral applications. The USB 3.0 IP integrates high-speed mixed signal circuits to support SuperSpeed traffic at 5Gbps and is backward compatible with USB 2.0 and USB 1.1. The IP is optimized to provide minimal die area and low power consumption. M31 Technology USB 2.0 and USB 3.0 PHY are both USB-IF Certificated since 2012.
"We are glad to see this successful bundle solution. Combining both parties' strengths, the GUC/M31 USB 3.0 offers a fast and reliable path to market." said CJ Liang, Vice President of R&D at GUC.
"This announcement is the first in a series of high speed interface bundling collaborations," explained Meisie Jong, Vice President of Sales at M31 Technology Corporation. "We share with GUC a mutual commitment to reduce design time and design costs through our bundle solution."
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.
About M31 Technology
Founded in 2011, M31 technology is a professional silicon Intellectual Property (IP) provider headquartered in Hsinchu, Taiwan. M31 has strong R&D and service team with extensive practical experience in IP, IC design and design automation fields. Our product is focused on high-speed Interface design, memory design, cell-lib design. M31's vision is to be the most trustworthy IP company in the semiconductor industry.
For more information please visit the company’s web site at http://www.m31tech.com
|
M31 Technology Corp. Hot IP
- USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm,6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
- PCIe 4.0 PHY in TSMC(6nm,7nm, 12nm,16nm)
- MIPI M-PHY v3.1 IP in TSMC(12/16nm, 28nm, 40nm, and 55nm)
- MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
- SerDes PHY IP in TSMC (7nm, 12/16nm, 22nm, 28nm)
Related News
- Faraday's USB 3.0 Solution, from PHYs to Device Controllers, Are All Certified with Logo on Products
- Faraday Technology and Fresco Logic Partner to Validate SuperSpeed USB PHY (USB 3.0) with SuperSpeed Digital xHCI Host and Device Controller
- PLDA and M31 Announce a Compliant PCI Express 3.0 Solution Including PLDA's XpressRICH3 Controller and M31's PHY IP for the TSMC 28HPC+ Process Node at 8 GT/s
- PLDA and M31 Technology Combine PCIe 3.0 Controller and PHY IP for a Complete, Reliable ASIC Design Solution
- M31 Technology Announces its USB 3.0 PHY Completed TSMC IP Validation
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |