M31 Technology USA is established
Hsinchu, Taiwan, Feburary 17th, 2014 – The global boutique Intellectual Property (IP) provider M31 Technology Corporation is announcing the establishment of its USA office in the heart of California’s Silicon Valley. Led by Samuel Lee as the General Manager of the US affiliate, M31 is looking forward to expanding its business throughout North America.
M31 Technology Corporation was founded in 2011 by a team of engineers and innovators with expertise in IP research and development. Headquartered in Taiyuan Science Park, Zhubei City, Taiwan, M31 provides a combination of high performance and low power consumption IPs such as USB, SATA, PCIe, and MIPI. In addition, M31 provides standard cells and memory compiler. Many of M31’s IP design-in products are currently in mass production. Utilizing each individual’s years of experiences in IC design service, semiconductor process technology and electronic design automation (EDA), M31 challenges the status quo in the industry.
In partnering with semiconductor foundries, M31’s partnerships provide top class IP products including M31’s USB products that are both USB-IF certificated. In 2013, M31 was certified by ISO 9001 and gained the “New Emerging IP Provider” award from TSMC resulting in a flourishing partnership with TSMC as its qualified IP provider.
M31 currently provides IPs to IC design companies and supply chains throughout Taiwan, USA, Europe, Korea, Japan and China. Through the new USA office, M31 will be looking to provide effective and streamlined IP services to semiconductor companies, electronic products and IC design companies in Canada and the United States.
|
M31 Technology Corp. Hot IP
- USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm,6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
- PCIe 4.0 PHY in TSMC(6nm,7nm, 12nm,16nm)
- MIPI M-PHY v3.1 IP in TSMC(12/16nm, 28nm, 40nm, and 55nm)
- MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
- SerDes PHY IP in TSMC (7nm, 12/16nm, 22nm, 28nm)
Related News
- New USA sales office of Digital Core Design
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year
- M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
- M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |