Industry's most trusted DSP architecture now powers audio/voice pre and post processing in Yamaha chips for mobile devices
BARCELONA, Spain -- Feb. 24, 2014 -- Mobile World Congress 2014 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Yamaha has licensed multiple members of the CEVA-TeakLite-4 DSP family of cores.
The fully synthesizable CEVA-TeakLite-4 DSP design addresses the need to run increasingly complex voice pre-processing algorithms, advanced audio post-processing, and always-on voice activation, a must-have feature in today's high-end smartphones, all at extremely lower power. The CEVA-TeakLite-4 DSP architecture, its instructions specific to audio/voice processing, and its cutting-edge power management and reduction technology offer Yamaha an indispensable platform to run ultra-low power audio and voice applications.
"Our comprehensive selection process has led us to understand clearly that the CEVA-TeakLite-4 cores have the industry-leading audio/voice DSP architecture, the smallest footprint, and the best power efficiency for mobile product ICs," said Nobukazu Nakamura, Manager of Strategic Marketing Department, Semiconductor Division, Yamaha Corporation. "We continue to work together with CEVA for the continual advancement of our audio/voice product roadmap, integrating leading-edge technologies, yet achieving better performance and greater power efficiency at the same time."
"We are delighted to announce Yamaha Corporation as the latest company to choose our CEVA-TeakLite-4 DSP architecture for their audio/voice product lines," said Gideon Wertheizer, CEO of CEVA. "Yamaha is a recognized leader in high-quality audio and voice processing technology and our DSP provides them with a fully programmable platform featuring ample processing horsepower to implement even the most sophisticated audio and voice use-cases."
The CEVA-TeakLite-4 is the fourth generation DSP based on CEVA-TeakLite, the most successful licensable DSP architecture in the history of the semiconductor industry, with more than 3 billion audio/voice chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice application needs. By taking advantage of the unified software ecosystem, a set of optimized software libraries and the integrated development environment, customers can easily reduce software development costs significantly while leveraging their software investment in future products. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, digital home and networking markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2013, CEVA's IP was shipped in over 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.