3DSP names Didier Boivin as new CEO and President

IRVINE, Calif., June 17, 2002 -- 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, today announced that telecommunication semiconductor-industry veteran, Didier Boivin, has joined the company as CEO and president.

"I am excited to join 3DSP and work with such an experienced team that has already won significant designs with major, prestigious system and semiconductor companies," said Didier Boivin. "With a strong IP business in place, I am looking forward to leading the company towards addressing a broader SoC business for DSP-oriented applications such as Multimedia, Voice over Packet and Wireless LAN. The company is in an excellent position to leverage its expertise in DSP architectures and broadband applications to expand and provide leading silicon IC platforms."

Prior to joining 3DSP, Boivin was the president of North American operations for DSP Group and CEO of its VoicePump IC subsidiary. During his tenure at VoicePump, Boivin lead the company in developing, manufacturing and selling integrated silicon and software solutions to the broadband market. Boivin has also held executive management positions at Alcatel Microelectronics, Rockwell Semiconductor Systems and TRT, a subsidiary of Philips.

Boivin holds an electrical engineering degree from Ecole Centrale d'Electronique in France, and an Executive MBA from the University of Texas in Dallas. Boivin succeeds Tom Beaver as the chief executive. Beaver has left the company to pursue other interests.

About 3DSP

3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object- oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in terms of performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Rd., Irvine, CA 92618, phone: (949) 435-0600 fax: (949) 435-0700.