Steffora Mutschler, Semiconductor Engineering
May 8th, 2014
Widespread use of 2.5D is still at least a year out from becoming a viable option but specific technical requirements are being identified along the way.
The semiconductor industry is still in the early stages of evolution in the realm of 2.5D, but when these devices do come out, the IP used on them will have to be brand new, according to Javier DeLaCruz, senior director of engineering at eSilicon.
“The IP causes the biggest risk that you’re going to have in this implementation,” he said. “Everything else in here for making those ASICs in a 2.5D structure is really not that different—same thickness of silicon; same processes; your bumps are smaller. But now you’re dealing with IPs that are different, made just for this.”
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