NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
What Apple Stuffed Inside iPhone 6 Plus
A8 SoC from TSMC
Cabe Atwell
EETimes (9/19/2014 07:40 PM EDT)
Love it or hate it, there's no question that Apple's iPhone line is popular, and while the numbers haven't officially been announced yet, the company has already broken its record for pre-orders online (roughly 4 million in a 24-hour period compared to the iPhone 5’s 2 million). The new smartphone comes in two flavors -- the 6 and the 6 Plus. In this teardown, we focus on Apple's flagship, the larger "phablet" 6 Plus.
The phone comes in three colors, including silver, gold, and "space grey" instead of the typical dirt-absorbent white of the earlier models. It's interesting to note that iFixit gave the new lineup an improved repairability score of 6/7 out of a possible 10, because of the phone now has an easily removable battery and the fingerprint cable no longer rips off when opening the case. Enough about the iPhone's aesthetics and sales numbers, let's get down to business and see what makes the 6 Plus tick!
- iPhone 6 Plus
- Case features
- Display takes serious real estate
- Apple A8 APL1011 SoC stars
- Lots of hardware in a small space
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
- A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal