Industrial IoT Drives Microsemi-Vitesse Merger
MIPS vs. ARM conflict on horizon
Junko Yoshida, EETimes
3/18/2015 00:00 AM EDT
MADISON, Wis. – In a sign that the rash of M&As among chip vendors has yet to subside, Microsemi Corp. announced Wednesday (March 18) its acquisition of Vitesse Semiconductor Corp. for $389 million.
Microsemi is paying $5.28 a share in cash for each Vitesse share, which represents a premium of 36% over Vitesse’s Tuesday closing. Under terms of the deal, Vitesse has reportedly until April 8 to solicit a superior counterbid, in what is known as a go-shop provision.
The merger’s focus is “communications semiconductors,” with plans to direct the combined company at “carrier, enterprise and industrial Internet of Things markets,” according to Microsemi’s statements.
E-mail This Article | Printer-Friendly Page |
Related News
- Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
- New POLYN Patent Covers Smart Tires, Industrial IoT Applications
- CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem
- Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process