UMC to Skip 20nm, Gun for 14nm FinFET
TAIPEI — United Microelectronics Corp. (UMC), which has once again become the world’s second-largest chip foundry, said Wednesday (April 29) that it will skip the 20 nm technology node as it aims to have 14nm FinFET tapeouts available for customers by the fourth-quarter of this year.
The Hsinchu, Taiwan company’s most advanced 28nm products accounted for 9% of its first-quarter revenue this year, ramping up from 7% in the fourth quarter last year as UMC gains a foothold in the technology node that larger rival Taiwan Semiconductor Manufacturing Co. (TSMC) has dominated for nearly five years.
UMC will skip 20nm products and target 14 nm FinFET as its next technology node to catch up with foundry rivals Samsung and TSMC. Samsung started making 14nm FinFET chips earlier this year while TSMC plans to begin commercial production of 16nm FinFET products in mid-2015.
“We have had good progress and met our high-performance device target,” said UMC CEO Po-Wen Yen, during a conference call to announce the company’s financial results for the first quarter of this year.
E-mail This Article | Printer-Friendly Page |
|
Related News
- UMC and Synopsys Collaboration Speeds 14-nm Custom Design
- UMC Collaborates with ARM to Validate UMC 14nm FinFET Process
- Synopsys and UMC Expand 14-nm FinFET Collaboration to Include DesignWare Embedded Memory and Test Solutions
- Synopsys and UMC Collaborate to Accelerate Development of UMC's 14-nm FinFET Process
- UMC Aligns With IBM on 20nm Process with FinFET 3D Transistors
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance