EDA Start-Up Intento Design Raises 900k Euros in Early Stage Funding
Paris, France – November 3, 2015 – Intento Design today announced that it has raised 900k Euros in early stage funding. The equity allows Intento to focus on product development as well as expansion of the company’s global sales and marketing efforts. Key investors in this round of funding include Seventure Partners, a leading European Venture Capital Fund Manager, and the FOREIS Endowment Fund.
Intento Design was founded in spring 2015 to provide responsive technology for analog IP. The company offers an innovative design methodology and tools that accelerate the design and technology migration of analog and mixed-signal integrated circuits. By adding a level of automation to the analog design process, the Intento Design methodology frees design teams to focus on innovation while getting complex SoCs to market faster.
The improved analog design methodology enabled by Intento’s technology provides a critical time-saving solution for designers of connected devices targeting the consumer electronics, Internet of Things (IoT), Big Data, Military, and Medical markets.
About Intento Design
Intento Design provides EDA tools that accelerate the design and technology migration of analog and mixed-signal circuits. By adding a level of automation to the analog design process, the Intento Design methodology frees design teams to focus on SoC innovation while achieving compressed time to market windows. For more information contact: http://www.intento-design.com.
|
Related News
- YOGITECH raises one million Euros in early stage venture capital financing from Toscana Venture
- Israeli AI startup NeuReality raises $35M Series A to bring its novel inferencing chip to the market
- SambaNova Systems Raises $676M in Series D, Surpasses $5B Valuation and Becomes World's Best-Funded AI Startup
- Israeli AI Chip Startup Raises Seed Funding
- Intrinsic ID Raises 2.5 Million Euros for Internet of Things Security
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |