Upgraded PUF-based Crypto Coprocessor (Compliant with TLS 1.3 / FIPS 186-5)
Scaling Down Semi Process Nodes for IoT Apps
Bernard Cole, EETimes
11/9/2015 10:00 AM EST
In recent months, some major semiconductor companies and IC foundries have announced that they have scaled down transistor sizes in ICs to as little as 14 nanometers, setting the stage for the next step in reducing size and cost of Internet of Things system-on-chip designs.
Not so fast, said Tom Starnes, semiconductor industry analyst at Objective Analysis. He points out that most of these announcements have more to do with standard microprocessor architectures and are unrelated to the requirements of Internet of Things (IoT} devices.
E-mail This Article | Printer-Friendly Page |
Related News
- Cadence Collaborates with Samsung Foundry to Accelerate Hyperscale Computing SoC Design for Process Nodes Down to 4nm
- Synopsys and Samsung Foundry Collaborate to Deliver Fastest Design Closure and Signoff for Process Nodes Down to 3nm
- NSCore Inc. Addresses the IoT Market Need for an NVM IP Solution in Advanced Process Technology Nodes
- Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications
- Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024