e2v strengthens semiconductors business with acquisition of Signal Processing Devices
February 3, 2016 -- e2v has strengthened its investment in high performance electronic solutions with the acquisitioni of Swedish signal processing design and development company, Signal Processing (SP) Devices.
SP Devices offers expertise in embedded error correction solutions for signal processing sub-systems and provides digitizers for demanding applications such as communications, radar and signal intelligence.
With this added expertise, e2v will offer solutions in error correction services for increased performance in time-interleaved Analog-to-Digital Converters (ADCs), linearized components, system and quadrature demodulators, and develop plans to release ADCs with enhanced performance specifications.
Richard Gibbs, President of e2v Semiconductors, said, “SP Devices presents excellent synergy with our existing data converter business; we continue to build on our signal processing chain solutions and these will now include digitizer boards, modules and even more service offerings.”
Tomas Wolf, CEO of SP Devices, commented, “We are excited to be a part of a company that values our heritage and continuously pushes the limits of what is possible in data acquisition solutions. In addition, for all our OEM customers this will provide additional organizational strength and capacity required for continued growth.”
Visit www.e2v.com/Semis for more information
|
Related News
- Renesas to Acquire Reality AI to Bring Advanced Signal Processing and Intelligence to the Endpoint
- Analog Devices Acquires HDMI Business From INVECAS, Expanding High Performance Audiovisual Capabilities
- Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices
- CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
- Seamless Devices Introduces New Analog Signal Processing Solutions That Aim to Enhance the Effectiveness of LTE, WiFi and Microwave Applications
Breaking News
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |