TSMC's 300mm Chinese Wafer Fab Wins Approval
Peter Clarke, EETimes
2/3/2016 10:00 AM EST
The Taiwanese government has given foundry chipmaker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) approval to build a 300mm wafer fab in China, according to reports that reference the Investment Commission of the Ministry of Economic Affairs.
TSMC already operates one fab in China, but until the latest ruling the Taiwan government forbade Taiwanese companies from owning and operating fabs that process the more cost efficient larger wafer size.
Taiwan announced a plan to invest about $3 billion in building a wafer fab in Nanjing, Jiangsu Province, China in December 2015. The facility is planned for a capacity of 20,000 wafer starts per month and would begin volume production of 16nm FinFETs in second half of 2018, but the plan was subject to Taiwan government approval. At the time TSMC chairman Morris Chang said such a move would provide closer support to TSMC's customers there and further expand the company’s business opportunities.
E-mail This Article | Printer-Friendly Page |
|
Related News
- No cost benefit in China wafer fab, says TSMC's Chang
- Politics Haunts TSMC's US Fab Plan
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
- TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
- Report: TSMC's 3nm Fab Could Cost $20 Billion
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024