Freescale Takeover Makes NXP Largest Automotive Chip Vendor
Christoph Hammerschmidt, EETimes
4/7/2016 08:20 AM EDT
MUNICH—According to the latest analysis by market watcher Semicast Research, NXP was the leading vendor of semiconductors to the OE automotive sector in 2015. Infineon passed Renesas Electronics to become the second largest vendor, with STMicroelectronics and Texas Instruments completing the top five. Semicast estimates that revenues for OE automotive semiconductors totaled USD 28.2 billion in 2015.
Supplier consolidation and currency movements are the key factors influencing changes in the vendor share ranking in 2015. NXP completed the acquisition of Freescale Semiconductor in early December 2015, propelling the combined company to the top of the share ranking, with an estimated 14.5 percent. Similarly, Infineon’s acquisition of International Rectifier in January 2015 moves it ahead of Renesas to number two, with an estimated market share of 10.1 percent. Having been the largest semiconductor supplier to the OE automotive sector for each of the last five years, Renesas is thus relegated to third position in the vendor share ranking in 2015, with an estimated 9.5 percent share.
E-mail This Article | Printer-Friendly Page |
Related News
- NXP + Freescale Merger Set To Create Leading Vendor of Automotive Semiconductors in 2015; Renesas Was The Largest Vendor in 2014
- NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM
- IAR Systems enables next generation automotive applications with NXP's S32K3 MCU family
- NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology
- NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows