32-Bit RISC-V Embedded Processor and Subsystem, Maps ARM M-0 to M-4. Optimal PPA,
GUC Monthly Sales Report - May 2016
Hsinchu, Taiwan, June 6, 2016 - GUC (TAIEX: 3443) today announced its net sales for May 2016 were NT$696 million, up 36.1% month-over-month and increase 26.6% year-over-year. Net sales for January through May 2016 totaled NT$3,428 million, an increase of 19.5% compared to the same period in 2015.
GUC Sales Report:
(NT$ thousand)
Net Sales | 2016 | 2015 | MoM (%) | YoY (%) |
May | 696,418 | 550,006 | 36.1% | 26.6% |
Year to Date | 3,428,238 | 2,870,003 | N/A | 19.5% |
Note: Year 2016 figures have not been audited.
GUC May 2016 Sales Breakdown:
(NT$ thousand)
Product Items | Net Sales | % |
ASIC | 433,330 | 62 |
NRE | 258,190 | 37 |
Others | 4,898 | 1 |
Total | 696,418 | 100 |
Note: Year 2016 figures have not been audited.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu, Taiwan GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, please visit www.guc-asic.com.
|
Related News
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |