UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs
Specialized process supports automotive ICs that require maximum reliability at the highest operating temperatures
Hsinchu, Taiwan, August 01, 2016 – United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has verified on silicon its 0.18um Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive ICs. The process is now ready for mass production, with qualified FDK and IP available for automotive applications such as power management IC (PMIC). The successful qualification enables UMC manufactured chips to be used for high-reliability vehicle applications within high temperature environments, and follows upon the foundry’s successful mass production of AEC-Q100 Grade-1 automotive ICs.
“Semiconductor content in vehicles continues to increase at a rapid pace as auto electronics such as ADAS, infotainment and navigation constantly evolve,” said SC Chien, senior vice president and head of corporate marketing at UMC. “More recently, higher expectations for emission reduction & energy efficiency have driven the demand for more advanced power electronics technology and components, which require the most stringent AEC-Q100 Grade-0 manufacturing to meet high temperature, zero-defect requirements. With our 0.18um BCD process, UMC is one of the only foundries compliant with AEC-Q100 Grade 1 & 0 semiconductor production specifications, and we look forward to helping more foundry customers gain entry into the thriving automotive IC market.”
UMC has a successful history as an automotive IC supplier, being the first foundry to receive ISO 22301 certification for business continuity management. The foundry implements a comprehensive “Automotive Service Package” that incorporates zero-defect manufacturing practices to help customers meet automotive quality requirements. In addition, UMC offers comprehensive Grade-0 IP including standard library, SRAM and OTP/MTP/eFuse that have been silicon verified in automotive IC products. ICs manufactured at UMC have been widely adopted by the world’s most well-known carmakers in Japan, Europe, Asia and the United States.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry’s highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICs found in cars. UMC’s 10 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs more than 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com
|
Related News
- Synopsys Interface IP Portfolio on 16-nm FinFET Process Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements
- Dongbu HiTek Accelerates Drive into Automotive Electronics ICs Winning AEC-Q100 Certifications for Process Technologies and IP
- eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process
- Chipus Microelectronics launches a battery charger IP in a 0.18um BCD process
- Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |