North American Semiconductor Equipment Industry Posts September 2016 Book-to-Bill Ratio of 1.05
SAN JOSE, Calif. — October 20, 2016 — North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05, according to the September Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI. A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.
SEMI reports that the three-month average of worldwide bookings in September 2016 was $1.60 billion. The bookings figure is 8.5 percent lower than the final August 2016 level of $1.75 billion, and is 3.2 percent higher than the September 2015 order level of $1.55 billion.
The three-month average of worldwide billings in September 2016 was $1.53 billion. The billings figure is 10.2 percent lower than the final August 2016 level of $1.71 billion, and is 2.6 percent higher than the September 2015 billings level of $1.50 billion.
"Semiconductor equipment bookings continue to outpace equipment billings,” said Denny McGuirk, president and CEO of SEMI. “Year-to-date bookings and billings data are on trend to surpass last year's levels.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
Billings | Bookings | Book-to-Bill | |
April 2016 | $1,460.2 | $1,595.4 | 1.09 |
May 2016 | $1,601.5 | $1,750.5 | 1.09 |
June 2016 | $1,715.2 | $1,714.3 | 1.00 |
July 2016 | $1,707.9 | $1,795.4 | 1.05 |
August 2016 (final) | $1,709.0 | $1,753.4 | 1.03 |
September 2016 (prelim) | $1,534.4 | $1,604.1 | 1.05 |
Source: SEMI (www.semi.org), October 2016
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the SEMI Equipment Market Data Subscription (EMDS).
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information about SEMI, visit www.semi.org
|
Related News
- North American Semiconductor Equipment Industry Posts July 2016 Book-to-Bill Ratio of 1.05
- North American Semiconductor Equipment Industry Posts October 2013 Book-to-Bill Ratio of 1.05
- North American Semiconductor Equipment Industry Posts October 2016 Book-to-Bill Ratio of 0.91
- North American Semiconductor Equipment Industry Posts August 2016 Book-to-Bill Ratio of 1.03
- North American Semiconductor Equipment Industry Posts May 2016 Book-to-Bill Ratio of 1.09
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
E-mail This Article | Printer-Friendly Page |