Xilinx Issues Product Advisory
SAN JOSE, CA, JANUARY 13, 2004 -- Xilinx, Inc. (Nasdaq: XLNX) has issued a product advisory potentially affecting certain lots of its Virtex-II Pro and XC2V6000 products using flip chip technology. The affected parts were manufactured using improper solder material that may cause random upset of device configuration. This issue is isolated to a limited number of parts assembled in calendar 2003, using a packaging substrate from only one of our substrate vendors. The issue has subsequently been resolved and shipments with proper solder have resumed. Xilinx is currently identifying and notifying all customers and is working on an individual basis with customers to address their particular situation. There will be no material impact on the December quarter 2003 or March quarter 2004 financial results.
This release contains forward-looking statements and projections. Actual events and results may differ materially from those in the forward-looking statements and are subject to risks and uncertainties including our ability to deliver replacement product to customers in a timely manner, reliance upon third party suppliers, Xilinx's ability to accurately identify all affected products in inventory, and other risk factors listed in our most recent Form 10K.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
-30-
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Issues Statement in Response to Analog Devices Patent Infringement Lawsuit
- Xilinx issues Spartan-3 recall
- Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership
- New Wave Design and Verification Appoints Ike Song to Advisory Committee
- Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |