NEC Electronics Acquires License of FlexRay IP from Bosch
FlexRay is a next-generation high-speed serial communication system for in-vehicle network, which offers high bandwidth (¡Ý10 Mbits/s) and flexible configuration options. By complementing the existing in-vehicle networking standards CAN, LIN and MOST, it will enable carmakers and system suppliers to develop entirely new and innovative system concepts for future vehicles.
¡°NEC Electronics is fully committed long-term to the global automotive market,¡± says Minoru Matsuda, General Manager of 3rd System LSI Division of the 2nd Business Development Operations Unit in NEC Electronics Corporation. ¡°Through this technical partnership with Bosch, NEC Electronics will continue to deliver new solutions to our automotive customers that meet and exceed their future performance and networking requirements.¡±
First silicon for development and prototyping is scheduled to be available in the first quarter of 2005. This product will be the first device in an NEC Electronics FlexRay roadmap, followed by a qualified second product with sample availability scheduled for fourth quarter 2005. With this product line, NEC Electronics is meeting a strong market demand.
NEC Electronics¡¯ aim is to become a major supplier of FlexRay products. With these devices, NEC Electronics complements its roadmap of automotive products, supporting the innovative communications network requirements for future automotive applications in terms of communication bandwidth and deterministic fault-tolerant data transmission. Typical FlexRay target applications are powertrain applications and chassis control including x-by-wire systems.
About NEC Electronics CorporationNEC Electronics (TSE: 6723) worldwide specializes in semiconductor products encompassing advanced technology solutions for the high-end computing and broadband networking markets, system solutions for the mobile handsets, PC peripherals, automotive and digital consumer markets, and platform solutions for a wide range of customer applications. NEC Electronics Corporation has 24 subsidiaries worldwide including NEC Electronics America, Inc. (www.necelam.com) and NEC Electronics (Europe) GmbH (www.ee.nec.de). In addition to marketing, selling and supporting NEC Electronics products to customers in their respective regions, NEC Electronics America and NEC Electronics Europe also operate local manufacturing facilities in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC Electronics America for North America and NEC Electronics Europe for Europe are the sales and marketing channels of NEC AM-LCD and PDP modules. For additional information about NEC Electronics worldwide, visit www.necel.com.
###
|
Related News
- Rambus Signs Patent License Agreement with NEC Electronics
- Fujitsu Announces FlexRay License Agreement with Bosch
- NEC Electronics and Mysticom Ink Ethernet Core License Agreement
- Core Wireless Announces Patent License Agreement With Global Consumer Electronics Manufacturer
- Acacia Subsidiary Acquires Additional Patents from Renesas Electronics Corporation
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |