NewLogic Technologies Names New Head of R&D
Axel Jahnke assigned as VP Research and Development
Lustenau, Austria; March 25th, 2004 - NewLogic Technologies, a leading supplier of wireless intellectual property (IP) cores and design services, named Axel Jahnke as Vice President in charge of Research and Development, effective March 2004.
Axel Jahnke joined NewLogic in January 2003 for heading the design center in Munich, Germany. In his new position he will be responsible for developing and leading the activities of all the company's research and development centers and engineering staff.
NewLogic employs more than 180 highly qualified digital, analog and RF engineers based in Lustenau (Austria), Sophia-Antipolis (France), Munich (Germany) and in the recently opened Design Center in Geneva (Switzerland). The company has also subsidiaries in San Jose/US and Singapore.
Axel Jahnke's background includes more than 11 years executive R&D experience in the global semiconductor industry. Before joining NewLogic Axel held R&D management positions at Infineon Technologies and Multilink Technology. He holds a masters degree in Electrical Engineering from the Technical University of Berlin, Germany."Axel's management experience provides significant leadership for our engineering team securing the timely execution of our customer design service projects and our internal IP development", Hans-Peter Metzler, President and CEO, commented."Especially for our WLAN system IP, he will ensure that the company maintains and further expands its technological leadership".
About NewLogic Technologies
NewLogic Technologies, headquartered in Lustenau, Austria, is a leading global supplier of IEEE 802.11 Wireless LAN and Bluetooth intellectual property (IP) cores and next generation cellular technology. In addition NewLogic offers IC design and IP Integration to help its customers achieve their aggressive time to market goals.
|
Related News
- AI Silicon IP Provider Expedera Opens R&D Office in Singapore
- M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
- SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
- Industry R&D Spending To Rise 9% After Hitting Record in 2021
- "Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
E-mail This Article | Printer-Friendly Page |