Innova Card, semiconductor fabless company designing and supplying secure solutions for smart card terminals, Closes a Financing Round of EUR 1.6 million
Based on its secure component USIP® (Universal Secure Integrated Platform), Innova Card offers modular hardware and software solutions to terminal manufacturers in order to develop new product ranges while reducing significantly their cost prices. The security, the performance and the painless integration of the chip USIP® are advantages of paramount importance to speed up the development and launching of new smart card terminals on a financial market today migrating to the international EMV standard. Moreover, the urgent need for securing electronic transactions on Internet or other networks in applications such as the healthcare or the identity with smart cards, opens up very promising market opportunities to answer to the demand of professionals and individuals.
This capital increase will help Innova Card launch its solution USIP® Professional built around the most secure and most integrated chip for EMV payment terminals. The chip will be available on the market by the third quarter of 2004.
Founded in June 2002 by four former engineers of ST Microelectronics and Gemplus, Innova Card is based out of La Ciotat, France, and has 16 employees. Web site: www.innova-card.com
|
Related News
- Innova Card, a fabless semiconductors company specialized in the design and development of secure solutions for smart card terminals, raises Euros 3.5 million with historical shareholders, Innovacom, LC Capital and Siparex Ventures
- SCALINX, Leading Fabless Semiconductor in System-on-a-Chip Design, Secures €34 Million in Second Round Funding
- Peraso Closes Oversubscribed $20 Million Equity Financing Led by Roadmap Innovation Fund
- Altair Semiconductor Raises $25 Million Financing Round
- GainSpan Closes $19 Million Series D Financing Round
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |