MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Xilinx Extends High-Speed Connectivity Leadership with RocketIO Design Services
Xilinx Design Services (XDS) guarantees low-risk multi-gigabit design and characterization
SAN JOSE, Calif., April 5, 2004 – Xilinx, Inc. (NASDAQ: XLNX), the world leader in programmable logic, today announced the addition of Xilinx RocketIO™ Design Services for backplane design, high-speed modeling, and physical channel characterization to its industry-leading RocketIO™ technology solution. RocketIO XDS expands Xilinx’ traditional system level design services beyond logic and embedded processing to include chip-to-chip high-speed serial connectivity and lab support for backplane applications. True to the company's proven customer success track record, RocketIO XDS guarantees shortened development cycles while further limiting schedule and technology risks associated with high-speed serial design. RocketIO XDS also eliminates the common pitfalls associated with signal integrity design issues providing first pass success, therefore saving designers development time and the cost of a major board re-spin. For more information about RocketIO XDS services, visit www.xilinx.com/esp/networks_telecom/optical/xlnx_net/rocketIO_xds.htm.
The RocketIO multi-gigabit transceiver technology offers the highest performance and most complete functionality of any embedded SerDes (Serializer/Deserializer) in the industry. Xilinx RocketIO MGTs enable serial connectivity between devices, backplanes, and subsystems that require high-speed serial data rates of up to 10Gbps, with signal integrity and maximum system throughput. This technology, combined with XDS’ combination of skills and experience in system level embedded and logic design, provides a unique development solution, helping designers to optimize budget, schedule and performance requirements for their high-speed, serial backplane design.
“Many network equipment companies have already completed high-speed designs utilizing RocketIO XDS and are designing next generation high-end systems with these expert design services and lab support,” said Tim Hemken, marketing director of the Communications Technology Division at Xilinx. “Our leadership role in signal integrity expertise for high-speed serial designs enables our customers to save precious development time and eliminate the need for costly board re-spins. This results in their ability to deliver products to market ahead of the competition.”
About Xilinx Design Services
Xilinx Design Services augments customer design teams with industry experts in FPGA design techniques and programmable logic solutions such as systems architecture consulting, hardware engineering, and embedded software design. Led by professionals with proven project management skills, the XDS team of FPGA hardware engineers, embedded software designers, signal integrity specialists, and system architects help customers deliver products to market faster, more cost-effectively, and with optimal performance. More information about Xilinx Design Services is available at www.support.xilinx.com/xds.
About Xilinx Line Card and Backplane Design Online Resource
Xilinx eSP (www.xilinx.com/esp) is a proven resource for engineers, dedicated to accelerating the development of products across a wide-range of markets and applications, including end-to-end programmable solutions across the line card and delivering a powerful array of solutions and information in a single location.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. Fore more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- LSI Logic extends leadership in high-speed serial interconnect with two GigaBlaze 0.11-micron multi-gigabit transceiver cores
- New Xilinx Spartan-6 FPGA Family Brings Low-Power and High-Speed Connectivity to Cost-Sensitive Electronic Systems
- Xilinx Helps Designers Meet High-Speed Connectivity Requirements With High-Performance Configuration and Storage Solution for Virtex-5 FPGAs
- Xilinx Simplifies and Lowers Cost for High-Speed Serial Design With New ChipScope Pro Serial IO Toolkit
- Xilinx Delivers High-Speed Interoperable Interfaces For Latest Texas Instruments DSPs
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |