English
Embedded platform company receives $7 million boost
| | |
| EE Times: Latest News Embedded platform company receives $7 million boost | |
| Peter Clarke (05/05/2004 1:38 PM EDT) URL: http://www.eetimes.com/showArticle.jhtml?articleID=19502364 | |
| READING, England -- Cross Atlantic Capital Partners has led a finance round that has raised more than US$7 million for Tao Group Ltd., maker of the Intent multimedia platform for mobile and other digital devices, Tao said Wednesday (May 5). The funding brings the total invested in Tao to more than US$45 million since the company was founded in 1992. Tao includes electronic systems companies Sony, Mitsubishi, NEC, Motorola and Sharp among its investors. Tao worked on virtual machine technology, and embraced the Java virtual machine in the 1990s. The latest additional funding coincides with recent license wins with OEMs, ODMs [Original Design Manufacturers] and MNOs [Mobile Network Operators], the company said. It was Cross Atlantic's second investment in Tao. "Intent is now a matured technology allowing the company to focus more strongly on securing globally-significant design wins. With the additional funding led by Cross Atlantic we will be able to pursue a much more aggressive go-to-market program in Europe, Asia and North America," said Francis Charig, Tao Group chairman, in a statement.
| |
| All material on this site Copyright © 2005 CMP Media LLC. All rights reserved. Privacy Statement | Your California Privacy Rights | Terms of Service | |
Related News
- DAFCA Receives $1.8 Million ATP Grant to Develop Reconfigurable Infrastructure Platform for System-on-Chip Electronics
- Embedded memory startup T-RAM receives $35 million in funding
- Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
- eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips
- Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round
Breaking News
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
- M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
Most Popular
- Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Microchip Technology Acquires Neuronix AI Labs
|
E-mail This Article | 
|
|
Printer-Friendly Page |