400G ultra low latency 56/112G FEC and SERDES IP sub 10ns latency
SIDSA announces the new "CARMeN-II" ARM emulation board for SoC Development &Validation
Tres Cantos, Spain, September 6st,2004 – SIDSA (Semiconductor Research and Development), a leading European provider of SoC design services and multimedia products, today announced a new ARM Design platform called “CARMeN-II”. Based on SIDSA’s proven line of ARM emulation products, it allows fast prototyping of large ARM-based ASICs on a single Xilinx XC2V6000 or XC2V8000 with physical interfaces to many peripherals such as Ethernet, USB, PCMCIA, smarcard, PCI, UART, CAN
Overview
Although ARM cores are today a widely used “de-facto” standard , development costs and time-to-market are considerable for custom ASICs or SoC (System on Chip) and new skills are required for hardware and embedded software design
Solutions
SIDSA’s seven years knowledge of ARM design is embodied into the “CARMeN-II” board. This fourth generation product combines SIDSA’s and customers’ experience in SoC design. Using the “CARMeN-II”, rather than relying on simulation only, ARM based designs can be quickly mapped into the emulation boards and debugged. This methodology is ideal for software / hardware partitioning and co-design. The embedded software can be fully verified in the target environment before and during IC tape-out.
As well as the on-board ARM7TDMI core, other cores and header cards are now available from SIDSA such as ARM720, ARM940/9TDMI, ARM920, ARM946.
When the decision is taken to product the ASIC, the same netlist can be given to a design house or foundry for the SoC place and route. As the ARM core is available in most silicon foundries, the decision to choose the component supplier can be taken at the end of the development cycle.
Availability and Pricing
Shipping, 1 to 2 weeks delivery time.
Prices, starting from 14k EUR (17.5k USD).
|
Related News
- SIDSA announces the "ADAC" ARM Automobile Design Platform for SoC Development Validation
- Atmel's FPSLIC II Dynamically Reconfigurable SoC Supports "Silicon-Sharing" For Peripherals & Interfaces
- Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
- Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
- Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |