Innovative Silicon hires Mark-Eric Jones as CEO
Silicon Valley executive joins memory technology start up
Lausanne, Switzerland, September 27, 2004 – Innovative Silicon, a privately-held semiconductor company funded by Index Ventures, Auriga Partners, Highland Capital Partners and Soitec announced that Mark-Eric Jones has joined the company as Chief Executive Officer. Most recently, Mark-Eric Jones served as Vice President & General Manager for the IP licensing business of MoSys (NASDAQ:MOSY) which he joined in 1998. Previously he was CEO and founder of 3Soft Corporation and continued to lead Mentor Graphics Corporation (NASDAQ:MENT) IP business unit “Inventra” after Mentor acquired 3Soft in 1996.
“We are delighted to welcome Mark-Eric to Innovative Silicon”, commented Pierre Fazan, founder and CTO of Innovative Silicon. “His general management and track record of building a successful IP licensing business for memory technology will be invaluable in helping the company through its next steps of growth”.
“I am very impressed by the technology that the team at Innovative Silicon has developed and excited to participate in a venture that promises to have a significant impact on the semiconductor industry” said Mark-Eric Jones.
Mr. Jones has been elected to serve on the board of directors of Innovative Silicon and will initially be based at the company’s Lausanne R&D centre.
Website : http://www.innovativesilicon.com
|
Related News
- DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon
- CEO interview: Alphawave IP's Pialis on chiplets and custom silicon
- TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
- Blu Wireless appoints Alan Jones as new Chief Executive Officer
- TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |