SoC integrators targeting portable audio applications such as Smart Phones, PMP, PDA… should demonstrate optimal recording performances as well as the best sound quality, while starring the longest playback capability.
sCODS95-N.01-Helium3-Bow, benefits from a new architecture combining the low power consumption from Helium architecture with ultra High Density. This audio CODEC silicon IP is thus the best ally of SoC integrators targeting high volume markets.
The Bow interface which enables to split the analog and digital parts on 2 separate dies offers ultimate flexibility. The highest density can be achieved by embedding the logic part in advanced process, such a split configuration ensures the easiest adaptations of digital functionalities for supporting various applications. Both parts are delivered in GDSII format, for a fastest and safest integration of the audio CODEC silicon IP.
- Ultra High Density for lowest fabrication cost
- High resolution: 95 dB SNR on the DAC to HP path
- Smooth design-In
- Patented PLL-less solution to avoid jitter due to audio PLL