Functionality
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1. DDR3/DDR4 PHY @ TSMC 28HPC+ 0.9V/2.5V
- DDR3-2133/DDR4-2666(or 2400)
- DFI compliant
- x32 basic, x16 optional
- Wire-bond basic, Flip-chip optional
2. DDR3/DDR4/LPDDR4 PHY @ TSMC 12FFC 0.8V/1.8V
- DDR3-2133/DDR4-3200/LPDDR4-3200
- DFI compliant
- x32 basic, x16 optional
- Flip-chip support
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External compatibility and integration requirements
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JEDEC compliant
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Timing or Performance requirements
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JEDEC compliant
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Technology Requirements
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1. DDR3/DDR4 PHY @ TSMC 28HPC+ 0.9V/2.5V
- DDR3-2133/DDR4-2666(or 2400)
- DFI compliant
- x32 basic, x16 optional
- Wire-bond basic, Flip-chip optional
2. DDR3/DDR4/LPDDR4 PHY @ TSMC 12FFC 0.8V/1.8V
- DDR3-2133/DDR4-3200/LPDDR4-3200
- DFI compliant
- x32 basic, x16 optional
- Flip-chip support
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Availability Timing
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F/E DK : `18/8
B/E DK : `18/11
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Support requirement
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On-site support needed : two times after chip out
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Quality requirement
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JEDEC compliant + alpha
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Other Constraints
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No patent issue.
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