TSMC looks to volume 7nm production in Q1 2018

TSMC intends to be in volume production on 7nm in Q1 2018, reports Digitimes, quoting Simon Wang, TSMC’s senior director of business development.

On 10nm, TSMC has received tape-outs on three designs and anticipates 10nm revenues in Q 2017.

For 5nm, TSMC expects risk production in H1 2019. It hopes to insert EUV processing into the production process at the 5nm node.

At the back-end, TSMC’s integrated fan-out (InFO) wafer-level packaging (WLP) technology is expected to generate $100 million plus revenues in Q4 2016, said Wang.