AEC Documents

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The following documents have been established by the AEC Technical Committee to define common electrical component qualification requirements. These documents contain detailed qualification and requalification requirements and include unique test methods and guidelines for the use of generic data. Components meeting these specifications are suitable for use in the harsh automotive environment without additional component level qualification testing. Suppliers may advertise components meeting these specifications without restrictions, but the specifications cannot be changed without the approval of the AEC Technical Committee.

Important: To view and download these documents free of charge simply click on the appropriate link.

• AEC Component Technical Committee Charter
  • AEC Component Technical Committee Charter - Rev-G
  • AEC Membership Application (as published in the AEC Charter Rev-G)

• AEC - Q100: Failure Mechanism Based Stress Test Qualification For Integrated Circuits
• AEC - Q100 Rev - J: Failure Mechanism Based Stress Test Qualification For Integrated Circuits (base document)
  
• AEC - Q100-001 - Rev-C: Wire Bond Shear Test
• AEC - Q100-002 - Rev-E: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q100-004 - Rev-D: IC Latch-Up Test
• AEC - Q100-005 - Rev-D1: Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test
• AEC - Q100-007 - Rev-B: Fault Simulation and Test Grading
• AEC - Q100-008 - Rev-A: Early Life Failure Rate (ELFR)
• AEC - Q100-009 - Rev-B: Electrical Distribution Assessment
• AEC - Q100-010 - Rev-A: Solder Ball Shear Test
• AEC - Q100-011 - Rev-D: Charged Device Model (CDM) Electrostatic Discharge Test
  
• AEC - Q100-012 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q101: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors
• AEC - Q101 Rev - E: Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors (base document)
• AEC - Q101-001 - Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q101-003 - Rev-A: Wire Bond Shear Test
• AEC - Q101-004 - Rev-: Miscellaneous Test Methods
• AEC - Q101-005 - Rev-A: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC - Q101-006 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q102: Failure Mechanism Based Stress Test Qualification for Discrete Optoelectronic Semiconductors in Automotive Applications
• AEC - Q102 Rev-A: Failure Mechanism Based Stress Test Qualification for Optoelectronic Semiconductors in Automotive Applications
• AEC - Q102-001 Rev- (Initial Release): Dew Test
• AEC - Q102-002 Rev- (Initial Release): Board Flex Test
• AEC - Q102-003 Rev- (Initial Release): Optoelectronic Multichip Modules (OE-MCMs)


• AEC - Q103: Failure Mechanism Based Stress Test Qualification for Sensors in Automotive Applications
• AEC - Q103-002 Rev - A: Failure Mechanism Based Stress Test Qualification for Micro Electro-Mechanical System (MEMS) Pressure Sensor Devices
• AEC - Q103-003 Rev - (Initial Release): Failure Mechanism Based Stress Test Qualification for MEMS Microphone Devices


• AEC - Q104: Failure Mechanism Based Stress Test Qualification For Multichip Modules (MCM) In Automotive Applications
• AEC - Q104 Rev - (Initial Release): Failure Mechanism Based Stress Test Qualification For Multichip Modules (MCM) In Automotive Applications


• AEC - Q200: Stress Test Qualification For Passive Components
• AEC - Q200 Rev - E base: Stress Test Qualification For Passive Components (base document)
• AEC - Q200-001 - Rev-B: Flame Retardance Test
• AEC - Q200-002 - Rev-B: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q200-003 - Rev-B: Beam Load (Break Strength) Test
• AEC - Q200-004 - Rev-A: Measurement Procedures for Resettable Fuses
• AEC - Q200-005 - Rev-A: Board Flex / Terminal Bond Strength Test
• AEC - Q200-006 - Rev-A: Terminal Strength (SMD) / Shear Stress Test
• AEC - Q200-007 - Rev-A: Voltage Surge Test


• AEC - Q001 Rev - D: Guidelines for Part Average Testing (provides guidelines for using statistical techniques and extended operating conditions to establish part test limits; this approach could be used to provide "Known Good Die.")



• AEC - Q002 Rev - B: Guidelines for Statistical Yield Analysis (provides guidelines for using statistical techniques to detect and remove abnormal lots of integrated circuits)



• AEC - Q003 Rev-A : Guidelines for Characterizing the Electrical Performance of Integrated Circuit Products


• AEC - Q004 Rev- (Initial Release): Automotive Zero Defects Framework (Describes a set of processes, methods, and tools based on industry best practices that suppliers and users of semiconductor products can use to drive to zero defects.)
  
  
• AEC - Q005 Rev - A: Pb-Free Test Requirements (Contains a set of tests and defines the minimum requirements for qualification of lead free (Pb-free) metallurgy for components to be used in any automotive electronics application)



• AEC - Q006 Rev - A: Qualification Requirements for Components using Copper (Cu) Wire Interconnects



• AEC - Q007: Failure Mechanism Based Testing Guidelines for Components Mounted to a Printed Board
• AEC - Q007 Rev- (Initial Release): Failure Mechanism Based Testing Guidelines for Components Mounted to a Printed Board
• AEC - Q007-001 Rev- (Initial Release): Board-Level Reliability Temperature Cycling Test Method
• AEC - Q007-002 Rev- (Initial Release): BLR Spreadsheets


• Document Removed - ISO/TS-16949: Customer Specific Requirements - Semiconductor Commodity

  Notice from the AEC Technical Committee: Supplements to TS-16949 are not allowed by the governing body (IATF/IAOB), only customer specifics. The authors of the QS-9000 Semi Supplement modified the document to be fully aligned with the new TS document and published it as ISO/TS-16949: Customer Specific Requirements - Semiconductor Commodity. The AEC did not issue the document as a supplement, but only as a document that was available for anyone to adopt as their customer requirement for semiconductor suppliers. Thus, the AEC posted the document on the website allowing anyone to take it, use it as is, or use it as a starting point for their own customer requirements. While TS16949 is required, the details, including what to do for semiconductors, is left up to each individual user for their specific requirements. The AEC was unable to communize the specific requirements, the document became inactive, and the AEC Technical Committee elected to remove the document from the website.

• DEHist 2000.1030: DE Histogram - Excel Add-in

  NOTE: DE Histogram is an Excel add-in that may be used to statistically analyze any data set, and graphically present the distributions of each variable. This software may be used freely, but it is currently unsupported. The sharing of software or other experience does not imply its fitness for your purpose, nor imply or express any warranty.

• AEC Templates and Forms
  • AEC - Q100 Rev H - CDC Template: Certificate of Design, Construction and Qualification (as published in AEC - Q100 Rev - H)
  • AEC - Q100 Rev H - QTP Template: Qualification Test Plan (as published in AEC - Q100 Rev - H)
  • AEC - Q102 Rev A - CDC Template: Certificate of Design, Construction and Qualification (as published in AEC - Q102 Rev-A)
  • AEC - Q102 Rev A - QTP Template: Qualification Test Plan (as published in AEC - Q102 Rev-A)
  • AEC - Q102 Rev A - Data Template: Qualification Data Presentation (as published in AEC - Q102 Rev-A)
  • AEC - Q102-003 Initial Release - Combined QTP-Data-Superset Template: Combined Qualification Test Plan, Qualification Data Presentation, and Superset of Tests (as published in AEC - Q102-003 Rev-)
  • AEC - Q102-003 Initial Release - Requal Matrix Template: Requalification Test Matrix (as published in AEC - Q102-003 Rev-)
  • AEC - Q103-002 Rev A - CDC Template: Certificate of Design, Construction and Qualification (as published in AEC - Q103-002 Rev-A)
  • AEC - Q104 Initial Release - CDC Template: Certificate of Design, Construction and Qualification (as published in AEC - Q104 Rev -)
  • AEC - Q104 Initial Release - QTP Template: Qualification Test Plan (as published in AEC - Q104 Rev -)
    
    
  
  

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  For additional information about these documents or the AEC, contact the AEC Technical Committee

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