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The chips will be made on TSMC’s 5nm EUV process and production starts in Q2 2020.
The iPhone requirement will absorb two thirds of TSMC’s 5nm capacity.
The other initial customer for the TSMC 5nm process is Huawei’s chip subsidiary HiSilicon.
As much as two thirds of TSMC’s available 5nm process capacity will be utilized to make the next-generation iPhone chips, the report said, citing sources at fab toolmakers.
TSMC is reported to have already moved its 5nm process technology to the risk production stage.
