Arteris® IP FlexNoC® Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS

by Kurt Shuler, On May 14, 2019

Mature network-on-chip interconnect technology enables smoother ASIL certification and time to market for AI-powered autonomous driving systems

CAMPBELL, Calif. –May 14, 2019– Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Black Sesame Technologies has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation automotive advanced driver assistance systems (ADAS) that utilize advanced artificial intelligence (AI) algorithms for autonomous driving capabilities.

Our new generation of autonomous driving systems require data protection within the on-chip NoC interconnect to meet ISO 26262 ASIL B functional safety requirements as well as extensive quality of service guarantees to meet the demanding needs of our AI hardware acceleration architecture. Arteris IP is the world leader in NoC interconnect technology and a pioneer in automotive and AI markets, and Arteris FlexNoC IP and the Resilience Package are helping us to more quickly develop our ISO 26262-compliant systems.”

David Zeng, VP of Engineering, Black Sesame

Black Sesame, headquartered in Silicon Valley, specializes in accelerating the performance of artificial intelligence algorithms in both hardware chips and software. They are partners with Bosch and Thundersoft and have been listed as one of the Top 50 startup companies in China. The Black Sesame engineering team chose FlexNoC NoC interconnect IP and the FlexNoC Resilience Package because of Arteris IP’s deep expertise in both automotive and AI markets and the maturity of the IP.

“Our new generation of autonomous driving systems require data protection within the on-chip NoC interconnect to meet ISO 26262 ASIL B functional safety requirements as well as extensive quality of service guarantees to meet the demanding needs of our AI hardware acceleration architecture,” said David Zeng, VP of Engineering of Black Sesame. “Arteris IP is the world leader in NoC interconnect technology and a pioneer in automotive and AI markets, and Arteris FlexNoC IP and the Resilience Package are helping us to more quickly develop our ISO 26262-compliant systems.”

“We are thrilled the Black Sesame team has chosen Arteris FlexNoC interconnect IP with the Resilience Package as their network-on-chip interconnect within their new automotive ADAS SoCs,” said K. Charles Janac, President and CEO of Arteris IP. “Arteris IP is the only IP company continually providing unique interconnect technologies that accelerate the development of complex autonomous driving chips with machine learning features and ISO 26262-compliant functional safety mechanisms.”

About Black Sesame Technologies

Black Sesame invents AI algorithms at the chip level in order to propel machine learning and create solutions for real world AI challenges. We specialize in codesigning industrial AI solutions from chip level all the way to application level. The founding team is ensembled with experts who have an average of 15 years experts in machine learning, image processing, computer vision, and chip design. Together, we build complete hardware and software solution for machine vision applications.

About Arteris IP

Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as BaiduMobileyeSamsungHuawei / HiSiliconToshiba and NXP. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety)FlexNoC AI Package, and PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com or find us on LinkedIn at https://www.linkedin.com/company/arteris.

Editorial Contact

Kurt Shuler
Arteris IP
+1 408 470 7300
kurt.shuler@arteris.com

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