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GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC’s Link for 3D die stacking) for the TSMC 3DFabric ... Read

DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core

Global IP Core Sales - The DVB-S2X LDPC Decoder is a powerful FEC core decoder for Digital Video Broadcasting via Satellite. It implements extensions ... Read

Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain ...

Dolphin Design, a pioneer in silicon IPs specializing in power-management, Audio and Very Edge Computing with AI capabilities, announces it is expanding ... Read

M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications

M31 Technology, a leading global provider of silicon intellectual property (IP), announced that its 5nm advanced process IP solution for high-speed interface ... Read

Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs

Faraday Technology announced it is leveraging the latest Arm® Automotive Enhanced (AE) technology, licensing the Cortex®-A720AE IP to drive the development ... Read

JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen ...

EDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of ... Read

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