Mask Data Preparation
- Generation of Multi Project Wafers (MPWs) or shuttles
- Generation of complex reticles
- Intuitive mask set creation
Dummy Filling
- 3rd Generation of dummy filling
- High speed parallel processing
- Available at chip level, reticle level or wafer level
Toolbox
- Powerful toolbox for GDSII, OASISย ยฎ, Mebes operations
- High reliability for last minute updates
- Secure your tapeout
Minimizing die fracture in 3DIC die integration
January 3rd, 2024
XYALIS, in collaboration with Mosis, has published a new article in the Journal of Micro/Nanopatterning, Materials, and Metrology about "Minimizing die fracture in 3DIC die integration".
The demand for high-performance semiconductor... [Continue Reading]
News & Press
XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems
December 19th, 2023 - News Grenoble, December 18th 2023XYALIS is proud to announce, under the European Union Defence Fund, the start of the Hartroid project. Hartroid stands for “Hardware Trojans Identification in Large-Scale integrated circuits”. Hartroid will develop a solution... [Continue Reading]
XYALIS at JEVeC conference 2023 in Japan
November 2nd, 2023 - News XYALIS will be present at the JEVeC 2023 Day (Japan EDA Venture Liaison Committee) in Kawasaki, November 27th, 2023. We will present our solution for frame generation step that plays a critical role in mask... [Continue Reading]
XYALIS at SPIE Photomask conference 2023
July 18th, 2023 - News XYALIS celebrates 25 years of providing state-of-the-art software solutions that increase productivity and reliability of Mask Data Preparation (MDP). With tools ranging from Multi Project Wafer (MPW) placement, frame generation, mask set design, field stitching,... [Continue Reading]
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To build reliable flows involving data exchange with other tools and equipments, XYALIS is fully compliant with SEMI standards.ย |
