D&R News Alert
May 29th, 2025


Welcome to the issue of May 29th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Secure-IC
Securyzr™ iSE S700 neo with MACsec:
Built-In Security for Connected Vehicles
  • Secures Ethernet links ensuring confidentiality, integrity & authenticity
  • AES-GCM 256-bit encryption for strong data protection
  • Compliant with IEEE 802.1AE & ISO 26262 (ASIL-B)
  • Scalable, throughout up to 1.6 Tbps
>> READ MORE >> READ THE PRODUCT SHEET

Foundry
■ TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive
■ TSMC dazzles in Amsterdam
I/O Library
■ One Platform, Five Libraries: Certus Semiconductor's I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies by Certus Semiconductor
Kamaten Technology
 • Quality AMS IP
• Joint IP Development
• AMS Design Services

Design Platform
■ Fault Management and Design-for-Test Strategies in Network Chip Architectures by University of California Davis and Cadence
Chiplet
■ Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
SMS Multiple-Proven Host/Device/OTG USB 2.0 PHY IP's
Soft Mixed Signal Corporation • Essential USB 2.0 Interface for IOT, Embedded, Auto SOC's
• Available at Legacy Nodes of 180nm-22nm; in 1B+ IC's
• Leading Edge Nodes: Robust eUSB2 due to DSP-Based Arch.
 Learn more >>

Memory IP
■ Brite Semiconductor Releases TCAM IP based on 28HKC+ Process
RISC-V
■ SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU
Security
■ ICTK Partners with BTQ of Canada for Quantum-safe Security Solutions
Automotive
■ Toward High-Density Embedded LiDAR for the Autonomous Vehicle of Tomorrow
From silicon to the use cases, SOIL as a test bench for automotive applications by Leonardo Govoni, AED Vantage

Artificial Intelligence
■ Towards next-generation edge-AI technologies: EU consortium opens services to external customers
Green Electronics

Webinar : Introduction to the Use Cases Developed
in the EECONE Project - Part 3
 When: June 17th 2025, 16.00pm - 17.00pm (Paris Time)
 Click here to register! >>

Partner News
■ EnSilica Establishes New Engineering Hub in Cambridge
Business News
■ Soitec reports fourth quarter revenue and Full-year results of fiscal year 2025
■ Ireland Maps Out ‘Silicon Island’ National Semiconductor Strategy
■ Rapidus to assist training in Vietnam's semiconductor industry





New IP
• DDI Sub Pixel Rendering by BTREE

What they said at
IP SoC Silicon Valley 25

Interview with Dana Neustadter - Sr. Director of Product Management Security IP - Synopsys, Inc.

Interview with Alexander Mozgovenko - Product Manager - CAST

Interview with Randy Caplan - CEO - Silicon Creations

Interview with Ravi Thummarukudy - CEO - Mobiveil Inc.

Interview with Andy Lee - Vice president, US marketing - Chips&Media, Inc.

Interview with Mahesh Tirupattur - CEO - Analog Bits Inc.

Interview with Floriberto Lima - CEO - SiliconGate

Interview with Farzad Zarrinfar - Senior VP of Sales and Marketing - Innosilicon

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