D&R News Alert
June 9th, 2025


Welcome to the issue of June 9th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Mixel has the most comprehensive MIPI portfolio and widest adoption in the industry
  • Latest IP solutions such as MIPI D-PHY, C-PHY,
    and M-PHY
  • Silicon-proven in 12 different nodes
  • Silicon-proven in 9 different foundries
  • Supports CSI-2, DSI-2, and UniPro/JEDEC UFS
Join Mixel at DAC 2025 (Booth #2616) – June 23-25

Foundry News
■ Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships
■ TSMC Achieves 90% Yield in 2nm Memory Chip Production
Design Tools and Platforms
■ Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation
■ Using Design-to-Test Workflows and Managing the IP Lifecycle in Chiplet Designs
Silicon proven Interface Components
• JESD204B, JESD204C, JESD204D and JESD204E IPs
• Interlaken IP with Retransmission and RS-FEC IP
• CPRI6.1/7, eCPRI, O-RAN and DIFI IPs
• UCIe for 12nm/22nm, MIPI I3C and RFFE IPs
Get in touch today
Chip Interfaces

RISC-V
■ Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development
Artificial Intelligence
■ Andes Technology Unveils AndesAIRE™ AnDLA™ I370: A Next-Generation Deep Learning Accelerator for Edge and Endpoint AI
■ VeriSilicon's Scalable High-Performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions
Synopsys
Unlock Next-Gen Real-Time Processing with Synopsys ARC Processor IP
• When : June 13 | 9 am PT
• Discover how Synopsys ARC Processor IP innovations like real-time virtualization, I/O optimization, and low-latency access can transform designs for automotive, AI/ML, and centralized E/E architectures. Learn to reduce silicon area, power, and system revalidation overhead while achieving deterministic performance.
 Learn More...

Automotive
■ CAST Expands Functional Safety Line with Additional Certified IP Cores
■ Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles
■ Arm Unwraps Automotive Compute Platform Aimed at ‘AI-Defined Vehicles’
■ Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems
ICTK
 • Visit ICTK @ DAC Booth #1218 from June 23 to 25
• Learn about ICTK’s PUF-based security solutions
• Secure assets, infrastructure, ID, and more with ICTK
• Explore more @ en.ictk.com

Multimedia
■ IntoPIX And Nextera-Adeas Announce Latest IPMX Demo Design With JPEG XS On Compact FPGAs At Infocomm 2025
■ IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs
Photonics
■ Imec and Ghent University build integrated microwave photonics chip
Green Electronics
■ Project GENESIS minimizes ecological footprint in Europe’s semiconductor industry
Business News
■ €1.1bn plan for GF fab in Dresden – reports
■ Qualcomm To Acquire UK's Alphawave For US$2.4 Billion - June 9, 2025






PUF FPGA-X Premium with key wrapping
• Proven “Soft” PUF implementation for AMD/Xilinx FPGAs, part of the FPGA configuration file
• Offers FPGA users a cryptographic technology to secure their own keys and to authenticate devices and communications between them

What they said at
IP SoC Silicon Valley 25

Post-Quantum Cryptography for IoT: Challenges and Adoption
Kris Kwiatkowski, Cryptography Architect, PQShield

LDPC based error correction solutions for Storage , Wireless and communication markets
Andrei Vityaev,Jaydeep Bhatt, Technical Advisor,Sr. Manager of IP design, Mobiveil Inc.

Meeting Automotive Design, Safety and Security Challenges with an Integrated HSM Solution
Raj Uppala, Senior Director of Marketing & Partnerships, Rambus, Inc.

Functional Safety Solutions for Automotive SoC Design
Kyle Weng, VP of Marketing and Sales, OPENEDGES Technology, Inc.

TSN Ethernet: Architectures and Applications
Alexander Mozgovenko, Product Manager, CAST

ISP Product for Automotive Camera Systems
Chris Wang, VP of Multimedia Technologies and a Member of CTO Office, VeriSilicon Inc.

Tech Trend of Image Signal Process with AI Technology
Jeiff Kim, SVP of Marketing/Sales, BTREE Co. Ltd.

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