D&R News Alert
June 30th, 2025


Welcome to the issue of June 30th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry News
■ Samsung Foundry Postpones 1.4nm Trial Line Investment, Focuses on 2nm
■ SMIC - Beneficiary of China’s Semiconductor Self-Sufficiency Drive
■ Global Semiconductor Foundry 2.0 Market’s Q1 2025 Revenue Jumps 13% YoY Driven by AI Chip Demand
CEVA Webinar: What It Really Takes to Build a Future-Proof AI Architecture?
When: Jul 15, 2025
Speakers:
  • Ronny Vatelmacher, Director of Product Marketing, Vision & AI, Ceva
  • Assaf Ganor, AI Architecture Director, Ceva
Register now >>>

Interface IP
■ SignatureIP Unveils Industry-Leading CXL 3.2 Solution for High-Performance Computing
■ AMD will launch PCIe 6.0 devices next year but consumers will have to wait almost half a decade to get it - here's why
RISC-V
■ RISC-V and AI: Innatera’s PULSAR Shakes Up the Edge
Image/Vision IP
■ VeriSilicon Expands DSP Portfolio with Silicon-Proven ZSP5000 Vision Core Series for Edge Intelligence
■ CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
Network IP
■ FH (Frequency Hopping) - OFDM Modem Available For Immediate Implementation From Global IP Core
Internet of Things
■ Ceva Brings Precise, Spatial Control to Smart TV, IoT Interfaces
Automotive
■ Ethernet IP Core for Next-Gen Automotive SoCs: Complementing CAN, LIN, and FlexRay with Scalable Connectivity
■ Vayavya Labs Accelerating Agile Automotive Development for OEMs and Tier-1s with Virtual ECUs
■ Level 2+ Could Be a Long-Term Middle Ground
Artificial Intelligence
■ The Upcoming NPU Shakeout - blog by Quadric
New Technologies
■ TU/e Launches Research Hub for Semiconductors and Photonics
■ VTT joins PIXEurope, the advanced European photonics pilot line
■ Photonics, Power, and Packaging at the 6G Research Frontier
■ Imec-Backed Eyeo Splits Light into Colors
Business News
■ Europe’s semiconductor leaders are racing to meet energy demands
■ U.K. Commits £670M to Accelerate Quantum Computing Development
■ Intel begins ‘major’ programme of layoffs and closes automotive unit






Synopsys USB4 PHY IP for TSMC N4P
• Optimized for performance, power, and area
• Includes one, two, or four full-duplex PAM-4 transceivers...

What they said at
IP SoC Silicon Valley 25

Scaling AI Infrastructures for the Future with Next-Gen Interconnects
Aparna Tarde, Sr. Staff Technical Product Manager, Synopsys, Inc.

Unleashing the Performance of AI Training with HBM4
Kevin Yee, Sr. Director of IP and Ecosystem Marketing, Samsung Foundry

Scalable, Flexible Edge AI accelerator - Silicon-Proven IP for Smart-X and Robotics
Lee Wang Lock, Senior Staff Research Engineer, AiM Future, Inc.

Generative AI on State Space Models for Edge Use Cases
Steven Brightfield, Chief Marketing Officer, BrainChip Inc.

Advanced Automotive AI Networks on a Scalable,Programmable GPNPU
Steve Roddy, Chief Marketing Officer, Quadric

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