D&R News Alert
July 14th, 2025


Welcome to the issue of July 14th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry Ecosystem News
Japanese Semiconductor Manufacturer Races Toward 2nm, Backed by IBM
IC’Alps Joins GlobalFoundries GlobalSolutions™ Ecosystem to Accelerate ASIC Development
Design Platform
Introducing Cadence's Virtuoso Studio RF: Advancing RF Design for 3D-IC - by Cadence Design Systems
Wavetek Deploys Silvaco’s Victory TCAD™ to Drive Innovation in GaN-Based Connectivity Solutions
Memory Interface Standards
JEDEC® Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
Webinar - Unpacking System Performance:
Supercharge Your Systems with Lossless Compression IPs
CAST

Presenter: Dr. Calliope-Louisa Sotiropoulou
CAST Sales Engineer & Product Manager
July 17th, 2025, 8am PDT | 11 am EDT | 5 pm CEE
Duration: 30 minutes

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Interface IP
Arasan Announces immediate availability of its Total IP for Embedded USB2 (eUSB2) with Controller and PHY
HPC Processor
Europe's first HPC ARM processor lands at TSMC
RISC-V
RISC-V Solidifies Presence in China as Global Momentum Builds
Automotive
From smarter sensing to safer driving: GlobalFoundries solutions driving ADAS innovation
Keysight and Korea Automotive Technology Institute Team Up to Improve Vehicle-to-Everything Component Testing
The Role of Data Annotation in Building Autonomous Vehicles - By Moschip
Aerospace Communication
IPrium releases SOQPSK-TG Demodulator for Aerospace Telemetry
Audio IP
Tech Note: Use this Flexible and Efficient AC’97 IP Core for Simple Audio Interfaces and Legacy System Upgrades
Partner News
First Tetrivis LTD Consumer Product is Finalist in IEEE Smart Lighting "Let's Make Light" Contest.
Ceva, Inc. Schedules Second Quarter 2025 Earnings Release and Conference Call
TSMC June 2025 Revenue Report
Business News
Samsung’s Q2 profit falls short as chip slump, tariffs take toll







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What they said at
IP SoC Silicon Valley 25


Building Tomorrow Today: Innovating with IP
Ook Kim, CEO, 4lynx, Inc.


makeChip: an accessible, cost-effective, and cloud-based Chip Design Platform
Florian Bilstein, Director Design Service, Racyics GmbH


Challenges of Porting ASIC IP Cores to FPGA: Tricky but Worthwhile!
Ettore Giliberti, Senior Staff Application Engineer, SmartDV Technologies


DFT Ready in RTL Level with SOC Canvas
Ahchan Kim, CTO, ITDA Semiconductor Co., Ltd.


PVT Monitors fulfilling the desire for increasing levels of control in Advanced nodes for complete Silicon Lifecycle management in SoCs
Rohan Bhatnagar, Product Manager, Synopsys, Inc.


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