D&R News Alert
July 28th, 2025


Welcome to the issue of July 28th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

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New Technology
■ Silicon Photonics Market to Hit Significant Growth
■ Paving the Way for Integrated Photonic Chips
Foundry and Foundry Ecosystem News
■ Intel facing another crossroads: 18 A or 14A process node
Design Platform
■ SWE-Bench-C Evaluation Framework - by Vayavya Labs
Interface IP
■ MIPI: Powering the Future of Connected Devices - By Rambus
■ Next-Gen High-Speed Transceiver IP Core Unveiled: Power, Performance, and Protocol Versatility in One Core
Products
 ❖ 28G Networking Serdes IP - by T2M

RISC-V
■ China Emerging as Significant Force in RISC-V Development and Adoption
■ How Next-Gen Chips Are Unlocking RISC-V's Customization Advantage – By Andes Technology
NEURON IP Advanced IC Design & Serial Interfaces
Neuron IP • Industry Leader in Purpose-Built Silicon Interfaces
• PPA Differentiated Solutions for AI & UCIe Chiplets
• Established Silicon-Proven Design Methodology
• Experienced SerDes & Memory Engineering Team

More at neuronip.com

Security
■ How the semiconductor industry is grappling with cybersecurity threats
Automotive
■ Arm Zena Compute Subsystems: Paving the Way to Scalable Automated Driving for the AI-Defined Era
■ How Tesla and Samsung's Strategic Alliance is Revolutionizing AI Semiconductors and Accelerating Autonomous Driving
Green Electronics
■ Fraunhofer develops ‘resource-efficient’ measurement system for semiconductor wafer production
■ How Ireland is powering a sustainable future for the global semiconductor industry
Partner News
■ The Blind Spot of Semiconductor IP Sales - by CoreHW
Business News
■ Intel Earnings Call Preview: 14A Strategy, Foundry Challenges, and More
■ Tech giant Intel cancels investments in Poland, Germany
■ SEMI Predicts Record $125.5 Billion in Global Semiconductor Equipment Sales for 2025
■ Top 5% Companies Sweep Profits in Global AI Semiconductor Industry






Synopsys High-Speed Test IO in TSMC N3P
• High-Speed Data Transfer: Enables data transfer rates of up to 2.5Gbps for efficient testing during manufacturing
• Accelerated Testing: Speeds up testing, reducing validation time and accelerating product development cycles

What they said at
IP SoC Silicon Valley 25

Unleashing the Performance of AI Training with HBM4
Kevin Yee, Sr. Director of IP and Ecosystem Marketing, Samsung Foundry

Scalable, Flexible Edge AI accelerator - Silicon-Proven IP for Smart-X and Robotics
Lee Wang Lock, Senior Staff Research Engineer, AiM Future, Inc.

Generative AI on State Space Models for Edge Use Cases
Steven Brightfield, Chief Marketing Officer, BrainChip Inc.

Advanced Automotive AI Networks on a Scalable,Programmable GPNPU
Steve Roddy, Chief Marketing Officer, Quadric

Securing Multi-Die Designs Starting with an Unclonable Root of Trust
Dana Neustadter, Sr. Director of Product Management Security IP, Synopsys, Inc.

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