D&R News Alert
September 25th, 2025


Welcome to the issue of September 25th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry Ecosystems News
■ Synopsys Collaborates with TSMC to Drive the Next Wave of AI and Multi-Die Innovation
■ Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric
■ Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
■ Analog Bits Adds New Power and Energy Management IP Blocks Proven on TSMC N2P and N3P Processes at TSMC 2025 OIP Ecosystem Forum
■ proteanTecs Announces Silicon-Proven IP on TSMC's Advanced N2P Process
■ eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award - September 25, 2025
Sofics High voltage tolerant I/O

• Enable high voltage operation, beyond foundry IO levels.
• 3.3V GPIO in 4nm based on 1.2V transistors

Info about Sofics >>

Chiplets
■ GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric® and Advanced Process Technologies
■ Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
■ Making connections: The pursuit of chiplet interconnect standardization
Analog IP
■ Perceptia Introduces pPLL08N: A Family of Compact Narrow-Band RF PLLs which Complement pPLL08W
Memory IP
■ Deca, SST collaborate on NVM chiplet solutions
■ M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6eTM Platform
Design Platform
■ Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
■ Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
Synopsys
Why Choose PCIe 5.0 for Power Performance and Bandwidth at the Edge?
Date: October, 2nd | 9 am PT
Unlock power, bandwidth, and efficiency at the edge. See how Synopsys PCIe 5.0 IP enables next-gen SoCs for automotive, mobile, and AI at the edge. Join our webinar to explore design insights and proven deployment strategies.
 Register Now! >>

RISC-V
■ T2M-IP's RISC-V Portfolio with Production-Ready CPU IP Cores for AI, Automotive, and Edge Applications
Security
■ EnSilica and Codasip announce strategic partnership
Space Applications
■ Arteris Selected by NanoXplore for Space Applications
Internet of Things
■ GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications
Automotive
■ MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM
Artificial Intelligence
■ TSMC, chip design software firms tap AI to help chips use less energy
■ Siemens adds AI to Simcenter Testlab to reinvent modal testing and analysis processes
■ BOS CEO, Jaehong Park, Introduces Eagle-N – Our Innovative AI Accelerator
■ NanoEdge AI Studio v5, 1st AutoML tool with Synthetic Data Generation
■ AI-Driven and Traditional Approaches to Accident Scenario Reconstruction - by Vayavya Labs
New Technology for AI Infrastructure
■ New Investments Flowing Into Photonics
■ Keysight to Demonstrate New Solutions that Support AI Infrastructure and Optical Innovations at ECOC 2025
Green Electronics
■ Driving Sustainability in Consumer Electronics
Starlight
Silicon Photonics Workshop
Lighting the Future: Advancing Silicon Photonics for the AI Connectivity Era

• When: September 30th 2025 - 6:00 - 9:00pm
• Where: 1 Hotel Krystalgade 22 1172 Copenhagen
 Register now >>

Business News
■ OpenAI and NVIDIA Announce Strategic Partnership
■ Samsung's Share in HBM Market Projected to Surpass 30% in 2026
■ TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC
What did they say at IP SoC China 2025?








Synopsys USB 3.1 PHY IP for TSMC N3A
• Lowest risk: Based on proven USB 3.0 controller shipped in...
• Lowest power: Extend battery life in mobile devices

New IP
• TSMC RC Oscillator_RCOSC by ARKCHIPS
• Linear Regulator for digital island in GF 22FDX by Dolphin Semiconductor

What they said at
IP SoC South Korea 25

Interview with Shahram Mossayebi - CEO - Crypto Quantique

Interview with Evan Price - CAST

Advanced Automotive AI/ML Networks
Seyoung (Sean) Park -, Applications Engineer, Quadric

Image compression for AI and machine learning
Jungmin Joo, Country Manager, intoPIX

How UCIe is Progressing to enable Chiplets
Hyoung-Bae Choi, Sr. Director, Synopsys, Inc.

Updated Methodology to Generate Optimal NoCs in 2025
John Min, VP of Customer Success, Arteris IP

Shaping the Future of High-Performance Chips: DRAM, SerDes, and Chiplet IP Innovations
Mason Li, VP, Director (ASIA ex-China), Innosilicon

Analog IP Solution for SAMSUNG Foundry
Myeonglyong Ko, R&D Center Director, LeoLSI

Advancing Power Telemetry
David Steer, VP Wordwide Sales, Movellus, Inc.

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