D&R News Alert
November 3rd, 2025


Welcome to the issue of November 3rd, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry News
■ TSMC A14 fab construction approved, set to start soon: Science park
■ GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
■ What Is A Foundry? The Hidden Hero Of Semiconductor Manufacturing
Design Platform
■ Introducing Microservice Store - A New Era for Embedded Systems Begins
■ Keysight Advances Quantum Engineering with New System-Level Simulation Solution
1G/2.5G/10G Base-T & 100/1000 Base-T1 Phys & MAC,
ISO26262 Certified
• Silicon proven, in 14/22/28nm, Porting Services Included
• Production SoC White-Box Database Transfer
• Leaders in Interface Semiconductor IP cores
• Hot IPs: RISC-V, NOCs, Wi-Fi7

Interface IP
■ ASIL Qualified MIPI C-PHY/D-PHY IP Core Delivering Industry-Leading Performance for Automotive SoCs in advanced process nodes
Chiplets
■ BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem
■ Chiplet-Based Solutions Accelerate the Development of Embedded NVM (SST)
■ Arm Opens Access to Chiplet Architectures and AI Platforms
RISC-V
■ The next RISC-V processor frontier: AI
CSI-2 + C/D-PHY@4.5gig 28nm - 4nm on multiple foundries
Arasan
  • ISO26262 ASIL-C Certified
  • Supporting speeds in excess of 4.5gsps
  • Meets the stringent safety requirements for automotive System-on-Chips (SoCs)
Learn More

Security
■ PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4
Artificial Intelligence
■ Siemens and Capgemini deepen partnership to empower industries for the next era of manufacturing
■ Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.
■ How Edge AI is Transforming Medical Diagnostics - by Key ASIC
■ Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory
■ Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market
Green Electronics
■ Recycling Rare Earths: Europe’s Push for Independence
DTI Green Membrane Switches >>
Rethinking Materials for a Circular Electronics Future

Webinar: Ecodesign of electronics for e-waste reduction
How to ease environmental assessment and anticipate circularity strategies
When: November 7th, 2025 | 16:00 - 17:00 (Paris Time)
Click here to register! >>

Partner News
■ QuickLogic to Exhibit at Embedded World North America 2025
■ Cadence Completes Acquisition of Secure-IC
■ Cadence forecasts fourth-quarter profit below estimates as US-China trade tensions weigh
Business News
■ European chips also for defense: Merz visits Globalfoundries
What's next for FD-SOI?
■ Northern Poland: Building Europe’s Next Semiconductor and Mobility Hub






Synopsys High Speed Ethernet PCS IP up to 200G
• Complaint with the IEEE 802.3bs standard
• 400G PCS available in single, quad or octal port supporting multiple...

What they said at
IP SoC China 25

Interview with Ravi Thummarukudy - CEO - Mobiveil Inc.

Interview with Franky Fan - Principal Field Application Engineer - Sifive, Inc.

Your Trusted Turnkey Partner with One-Stop IP and SoC Platform Solutions
Eunice Rao, IP Project Director, Brite Semiconductor

UCIe-S v2.0 PHY IP: Measured Si Results and Robust Design Methodology from Simulation to Silicon
Roger Han, Strategy & Marketing Team Leader, Qualitas Semiconductor

Highspeed Connectivity Solutions for 22nm Tech Nodes
Robert Kong, Extoll GmbH

Unlocking Computing Bottlenecks: How DRAM, SerDes, and Chiplet IP Are Reshaping the High-Performance Chip Landscape
Oliver Jia, IP&SoC Solution Architecture, Innosilicon

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