D&R News Alert
November 6th, 2025


Welcome to the issue of November 6th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Technology News
■ Samsung’s Taylor Plant In Texas About To Commence Operations, New Report Says ASML Will Form A Team Soon To Set Up EUV Machinery And Ease Production Transition
■ Europe Must Play to Its Strengths
True Circuits
  • Low-jitter, pin-programmable PLL and DLL hard macros
  • High-performance, general purpose and easy-to-integrate
  • TSMC, UMC and GF processes from 180nm to 4nm
TSMC 7nm CG H PLL >>
Learn more >>

Design Platform
■ Arteris Selected by Altera to Advance Intelligent Computing Across Cloud-to-Edge Applications
■ Perceptia Updates Design Kit for pPLL03 on GlobalFoundries 22FDX Platform
■ Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm
RISC-V
■ RISC-V Summit spurs new round of automotive support
Artificial Intelligence
■ Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure
■ Accelerating System Design with Real-Time Simulation, Powered by AI Physics - By Cadence Design Systems, Inc.
Protecting the AI Generation with PUF-
based Solutions Inside Every Chiplet
Book a meeting online or in person
at ICCAD (Nov.20-21 | Booth #D121)
PUF Security + Ememory • Bridging hardware and software for diverse end applications.
• Integrated anti-tampering design ensures secure operation.
• Compliant with global security standards to resist threats.
• Covering secure storage, root of trust, coprocessor, HSM, and PQC.

Security
■ CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores
Multimedia
■ CoreHW’s Locator and Tag Series Achieve Bluetooth Certification
Network
■ Why What Where DIFI and the new version 1.3 - by Chip Interfaces ApS
■ Keysight and MediaTek Collaborate to Advance Pre-6G Integrated Sensing and Communication Technology
Rambus
Rambus Design Seminar
Europe 2025
  • Join Rambus and key industry partners for an in-person event on Nov 26th
  • Explore next-gen IP for AI, including HBM4, PCIe 7, and Root of Trust
  • Learn how to reduce risk and accelerate time to market
  • Understand key regulations and security best practices
Register Today >>

Automotive
■ BOS Semiconductors Driving Innovation in Automotive AI Chips
■ SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles
Green Electronics
■ The Green Revolution in Silicon: Semiconductor Industry Ramps Up Sustainability Efforts
Business News
■ Logic Fruit Technologies Appoints Sunil Kar as President & CEO to Accelerate Global Growth
■ European sales of semiconductors up 7.2% QoQ in the last quarter
■ SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% Year-on-Year in Q3 2025
■ Canadian semiconductor leaders see opportunity, and risk, in US takeovers





New IP
• Post-Quantum Cryptography - Key Encapsulation IP Core (ML-KEM) by KiviCore
• eUSB 2.0 PHY IP by Arasan Chip Systems Inc.
• Radiation-Hardened GPIO, ODIO and LVDS Interface in SkyWater 90nm by Certus Semiconductor

What they said at
IP SoC China 25

Bringing Security to Chiplets for Trustworthy Systems in Package
Shengnan WANG, General Manager China, Secure-IC

The Widespread Use of LPDDR Memory Subsystem
Minlin Fan, China Country Manager & VP of Sales, OPENEDGES Technology, Inc.

GPU and RISC-V Collaborating for Smarter Automotive Solutions
Yin Huang, Head of Business Development, Imagination Technologies Group Ltd.

Neural Video Processor IP the AI Engine for Video
Yujing Wei, VP Sales & Country Manager APAC, Allegro DVT

A new era of on-device AI
Candida Sun, Sr. Application Engineer Manager, Imagination Technologies Group Ltd.

VeriSilicon's High-Performance Vitality GPU-AI IP Empowers AI PCs and Cloud Gaming Servers
Huiming Zhang, Sr. Vice President of GPU/Display Product, VeriSilicon, VeriSilicon Microelectronics (Shanghai) Co., Ltd.

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