D&R News Alert
November 10th, 2025


Welcome to the issue of November 10th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Technology News
■ TSMC’s 3nm Process Has Entered ‘Golden Period Of Mass Production,’ Estimates State That Monthly Wafer Production Can Reach 160,000 Units By The End Of 2025
■ TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens
■ High Tech Campus Eindhoven Invests in, and Constructs Building and Cleanroom Facilities for TNO’s 6-inch Photonic Chip Pilot Line
■ Day 2 of PIC Summit: Photonic Chip Applications Taking Centre Stage
Memory Matters: The State of NVM 2025
Arasan
  • Which NVM types are you using today?
  • What’s on your roadmap?
    Flash, MRAM, ReRAM, FeRAM, PCM, EEPROM…
  • What node & density are you targeting?
Share your view! >>

Design Platform
■ The Power of Shifting Left: Cadence Accelerating Innovation with Arm by Cadence Design Systems
Processor
■ The ISA Wars Have Ended And The Heterogeneous CPU Era Has Arrived
Secure-IC
Secure-IC Unveils Securyzr™ Xperience: Gateway to Security Innovation
  • Digital portal for early access to Secure-IC’s cutting-edge technologies
  • Assess performance, robustness and PPA in a realistic environment
  • Accelerate integration & time-to-market
  • Be the first to experience the power of Securyzr™
>> Read full details >> Dicover the platform

Security
■ ML-KEM explained: Quantum-safe Key Exchange for secure embedded Hardware - by KiviCore
Artificial Intelligence
■ 10 Tips for First-Pass Silicon Success in AI Chip Development
■ A Shared Commitment to Energy-Efficient AI – by TSMC
Synopsys Webinar: How PCIe Multistream Architecture is enabling AI Connectivity at 64 GT/s and 128 GT/s

Date: Nov 18, 2025 | 9:00 AM PST
Register Now! >>

Automotive and Space IP
■ QuickLogic Accelerates Space Innovation with Secure, Customizable eFPGA Hard IP
Green electronics

Leonardo Green Sensing Electronics for Structural Health Monitoring in Composite Aerostructures >>

Partner News
■ Keysight Recognized with 2025 TSIA STAR Award for Excellence in Omnichannel Customer Experience Optimization
■ Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions
True Circuits

Why settle for old DDR technology when doing chips at older nodes? TCI offers a production proven TSMC 40G LPDDR5-3200 hard PHY configured to your exact floorplan.

TSMC 40nm G 3200Mbps LPDDR5 PHY >>
Learn more >>

Business News
■ TSMC October 2025 Revenue Report
■ Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September
■ Adeia sues AMD for patent infringement over semiconductor technology
Book your Calendar! IP-SoC Events in 2026
IP-SoC Silicon Valley
April 23rd, 2026
IP-SoC China
September 10th, 2026
IP-SoC South Korea
September 15th, 2026
IP-SoC EU
December 8th-9th, 2026








PUF Software Premium with key wrap and certification support
• Most flexible and scalable PUF-based security solution for new and existing designs
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What they said at
IP SoC China 25

Scaling AI Infrastructures for the Future with Next-Gen Interconnects
Clark Zuo, Applications Engineering, Principal Engineer, Synopsys, Inc.

RISC-V Vector Compute for AI
Franky Fan, Principal Field Application Engineer, Sifive, Inc.

How to Build Robust Security into Your AI SoC Designs
Matthew Ma, Senior Staff FAE, Synopsys, Inc.

Protecting Data in Motion with MACsec
Kevin Zhang, SPE Field Applications Engineering, Rambus, Inc.

Advancing SoC debug and optimization with functional monitoring
Wei Zheng, Staff Application Engineer, Siemens - Tessent Embedded Analytics

IP vendor the seed of innovation in the semiconductor world
Gabrièle Saucier, CEO, Design And Reuse

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