D&R News Alert
November 13th, 2025


Welcome to the issue of November 13th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

CEVA Ceva-NeuPro-M Scalable NPU IP for Generative AI
• Highest power efficiency AI inferencing for cloud and edge devices
• Up to 7K Token-per-Second/Watt for a Llama 2 & 3.2 7B models
• Up to 400 TOPS per core and fully scalable to 1000+ TOPS
• Full AI SDK and AI frameworks support including TVM and ONNX
Learn More >>>

Foundry News
■ GlobalFoundries Licenses GaN Technology from TSMC to Accelerate U.S.-Manufactured Power Portfolio for Datacenter, Industrial and Automotive Customers
■ Metalenz and UMC Bring Breakthrough Face Authentication Solution Polar ID to Mass Production
Technology News
■ Light into data: How silicon photonics is powering the AI data center revolution
Design Partner of the Week
GUC GLink-3D/UCIe-3D and SoIC Total Service Package
GUC
  • Complete Service Scope : from IP, SoIC design to production
  • Silicon-proven IP with ultra low latency/power/area for 3D SoIC interfaces
  • Industry-leading SoIC design with proven track records
  • Visit GUC at tsmc Taiwan OIP (GUC booth #24)
 Learn more...

Design and Manufacturing Platform
■ Keysight Named a Leader in 2025 Gartner® Magic Quadrant™ for AI-Augmented Software Testing Tools
■ Siemens and NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
RISC-V
■ lowRISC® and Partners to Deliver Commercial-Quality, Open-Source CHERI Secure Enclave with InnovateUK Support
[Webinar] Memory IP for AI Accelerators: HBM4, LPDDR5, and GDDR7
Rambus
Learn about the latest advancements in HBM4, GDDR7, and LPDDR5X. Watch this webinar to learn how to select the right memory solution for your AI-driven applications.
Watch Now >>

Artificial Intelligence Solutions
■ VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP
■ Blaize Deploys Arteris NoC IP to Power Scalable, Energy-Efficient Edge AI Solutions
■ Innatera signs Joya, bringing neuromorphic edge AI into connected products
Automotive IP
■ United Micro Technology and Ceva Collaborate for 5G RedCap SoC to Accelerate Connected Vehicle Adoption
■ CAST Reaches 200 CAN IP Core Customers
Partner News
■ Key ASIC Signals Strong Growth Momentum Amid AI Boom
■ Cadence Welcomes ChipStack
■ TSMC Board of Directors Meeting Resolutions
■ QuickLogic Reports Fiscal Third Quarter 2025 Financial Results
■ Ceva, Inc. Announces Third Quarter 2025 Financial Results
Business News
■ TSMC sales solid, but may be slowing
■ European Technological Sovereignty: Visionary or Illusory?





What they said at
IP SoC South Korea 25

CFrame60 - Frame Buffer Compression for bandwidth reduction using lossy/lossless techniques in video processing
Junghyun Kwon, CTO, Chips&Media, Inc.

AV1 Video Encoder IP for Data Center-Grade Quality
Mickey Jeon, CEO, BLUEDOT

Efficient Lossless Compression: Trade-offs, Performance of Algorithms and IP Cores
Evan Price, CAST

Accelerating vector databases in the data-driven AI era
Se-Hyun Yang, CTO, Dnotitia

Scalable, Flexible Edge AI accelerator - Silicon-Proven IP for Smart-X and Robotics
Changsoo Kim, AiM Future, Inc.

Neural Video Processor IP the AI Engine for Video
Yujing Wei, VP Sales & Country Manager APAC, Allegro DVT

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